| Allicdata Part #: | ATS-06E-66-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-66-C1-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-66-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important heat-dissipation components used to ensure that electronic devices such as CPUs, microprocessors, and memory chips work properly. The ATS-06E-66-C1-R0 heat sink is a product of Thermaltake, one of the leading manufacturers of heat sinks. This model of heat sink is designed to provide efficient cooling for electrical and electronic systems that require a large amount of energy.The ATS-06E-66-C1-R0 is a two-piece, all-metal thermal heat sink that uses the latest technology in thermal management. The heat sink consists of a base, which is thermally conductive, and a top part, which is designed to dissipate the heat from the electrical components. It is designed to be mounted on a printed circuit board using M3 screws. The base of the heat sink is equipped with a thermal compound layer to ensure maximum heat transfer between the heat sink and the electrical components.This heat sink is designed to be used in applications where high-temperature components are required, such as processors, memory chips, high-power microcontrollers, and amplifier circuits. Its base is covered with a special thermally conductive material that helps to dissipate the heat away from the electrical components. The top part of the heat sink is designed to maximize the airflow, promoting cooling of the electrical components. The heat sink is also designed to reduce the vibration and noise from the electrical components that generates heat.The ATS-06E-66-C1-R0 is a thermally efficient heat sink that is designed to be used in applications where high-temperature components are required. Its two-piece construction ensures that the heat is dissipated quickly and efficiently, while the thermally conductive base ensures that the heat is evenly dispersed. The top part of the heat sink is designed to maximize the airflow, thus promoting efficient cooling. The heat sink is also designed to reduce the vibration and noise from the electrical components that generate heat. With its efficient thermal management and durability, the ATS-06E-66-C1-R0 heat sink is an ideal choice for applications requiring reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference