ATS-06E-95-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11546-ND

Manufacturer Part#:

ATS-06E-95-C2-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06E-95-C2-R0 datasheetATS-06E-95-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.37220
10 +: $ 4.25628
25 +: $ 4.02016
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is crucial to the operation and long-term life of any EM system or machine. Heat sinks help to rapidly cool any heat-producing components in the system, allowing them to be overloaded with higher voltages and currents for a much longer period of time. ATS-06E-95-C2-R0 is a type of heat sink that is highly efficient at dissipating heat. In this article, we will explore the applications and working principles of the ATS-06E-95-C2-R0.

The ATS-06E-95-C2-R0 provides effective heat dissipation in a wide variety of thermal management applications, including those where large current or high voltage needs to be dissipated quickly. It is versatile and can be used in applications ranging from control systems, DC/DC converters, military equipment, and robotics to automotive, avionics, and other consumer electronics. Its aluminum body is designed to efficiently cool the most extreme electronics while providing robust performance and shock-resistant construction.

The ATS-06E-95-C2-R0 works on the principle of thermal management. It is designed to dissipate excess heat that builds up in a system, as it uses a heat sink to conduct and release heat outside of the device into the surrounding environment. Heat sinks are commonly used in high-wattage and high-voltage applications due to the high efficiency that they offer. As these systems often produce large amounts of heat, having a heat sink to effectively dissipate it is highly beneficial.

The ATS-06E-95-C2-R0 operates on the principle of convection. The heat sink works by using two large dissipation plates on both sides of the heat pipe to transfer heat more efficiently. As the plates are larger than the heat pipe itself, more heat can be transferred and dissipated from the hottest elements in the system quickly and without interruption.

The ATS-06E-95-C2-R0 also utilizes high-quality materials such as aluminum and magnesium to provide superconductivity and ideal thermal management. The combination of these materials with its larger heat dissipation plates results in faster heat absorption and release into the environment. It also helps to reduce electrical waste and ensure maximum efficiency in all its applications.

The ATS-06E-95-C2-R0 is designed to be installed quickly and easily, reducing the time needed to mount the thermal management unit. It requires minimal space for installation, which makes it suitable for use in confined spaces. It is also highly reliable and durable to maintain a stable and long-term operation.

Overall, the ATS-06E-95-C2-R0 is an ideal choice for applications that require heat management. It is reliable, efficient, and easy to install, making it suitable for any variety of thermal management applications. With its high-quality materials and superior heat dissipation, the ATS-06E-95-C2-R0 ensures maximum efficiency and long-term operation.

The specific data is subject to PDF, and the above content is for reference

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