| Allicdata Part #: | ATS-06F-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions have become increasingly essential to the high-performance electronics market. The development of heat-generating components designed to process and control information has resulted in the need to reduce heat dissipation and to generally maintain proper system temperature. Heat sinks are essential elements of these thermal management solutions, helping to dissipate, store, and recirculate the heat generated by a variety of electrical components. One example of a heat sink solution specifically designed with the advances of heat-generating components in mind is the ATS-06F-02-C3-R0 heat sink.
The ATS-06F-02-C3-R0 heat sink is designed for application to high-power semiconductor components. It is integrated with a uniquely designed pin fin array, allowing it to effectively disperse heat from such components. The ATS-06F-02-C3-R0 is available in three size ranges, making it easier to accommodate different sizes of components and maximizing its cooling efficiency. It features a fin pitch of 2.0mm, resulting in low air-resistance heat dissipation, while a depth of 3.0mm allows for improved stability.
The ATS-06F-02-C3-R0 operates on the principle of passively transferring heat from an electrical component to a heat sink. Heat is generated when a power device such as a microprocessor, memory chip, or transistor is activated. This heat is then transferred to the ATS-06F-02-C3-R0 heat sink and further dispersed using the integrated pin fin array. This process effectively allows the heat to dissipate at an accelerated rate, thus reducing the temperature of the electrical components and protecting them from damage.
Additionally, the ATS-06F-02-C3-R0 also functions as a heat storage element. The heat is stored within the thermal mass of the heat sink and is released slowly, ensuring that the electrical components stay in thermal equilibrium. This heat storage function reduces the amount of energy needed to keep the electrical components cool, thus improving the overall efficiency of the system.
The ATS-06F-02-C3-R0 heat sink is an ideal solution for those looking to reduce the amount of heat generated by electrical components. Its uniquely designed pin fin array effectively disperses heat, while its thermal mass stores and slowly releases the dissipated heat. By reducing the temperature of electrical components, this heat sink improves the overall performance and efficiency of the system, while also protecting the constituent components from harm.
The specific data is subject to PDF, and the above content is for reference