| Allicdata Part #: | ATS-06F-110-C1-R1-ND |
| Manufacturer Part#: |
ATS-06F-110-C1-R1 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-110-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component in the operation of any piece of technology. Good thermal management allows hardware and components to stay within a safe and desired temperature range, while poor thermal management can lead to instability, higher power consumption, and even system failure. Heat sinks are one way of efficiently managing the heat produced by components in order to create a stable environment. The ATS-06F-110-C1-R1 is an example of a thermal heat sink that is designed to extend the life and performance of electronic components.
The ATS-06F-110-C1-R1 is a low-profile aluminum heat sink that features a ribbed finned surface area. This ribbed surface increases air convection to expel heat away from the components with which it is used. The aluminum material of the ATS-06F-110-C1-R1 is designed to rapidly and effectively dissipate heat from components while still maintaining a low-profile form factor. The ATS-06F-110-C1-R1 is ideally suited for applications where heat dissipation needs to be optimized while minimizing overall size.
The ATS-06F-110-C1-R1 has a wide variety of uses across multiple industries. It is well-suited for applications in communications, computing, industrial, medical, and automotive fields. Within these industries, it is commonly used to cool electronic components in a variety of devices. These can range from computers and servers to mobile phones, tablets, and other consumer electronics. It can also be used to cool components within industrial and medical equipment.
The ATS-06F-110-C1-R1 is well-suited for applications where the component is likely to operate at lower temperatures, such as in low-voltage systems. The heat sink can also be used to dissipate heat away from the component without the need for external fans, allowing for a more silent and efficient solution. Its low-profile design also allows it to be used in applications where there are size or space considerations.
The ATS-06F-110-C1-R1 is a highly efficient, lightweight, and reliable heat sink. Its ribbed fin design aids in faster heat transfer and dissipation, while its aluminum construction ensures efficient thermal conduction. With its low-profile design and efficient thermal dissipation capabilities, it is well-suited for cooling components in all sorts of devices and applications.
The specific data is subject to PDF, and the above content is for reference