| Allicdata Part #: | ATS-06F-128-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-128-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-128-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a crucial component in most electronic equipment. They help dissipate heat away from electronic components, reduce their temperatures, and ensure they don’t get too hot and cause damage. The ATS-06F-128-C3-R0 is an advanced heat sink designed to provide efficient cooling and heat dissipation for modern electronic systems. The ATS-06F-128-C3-R0 has a variety of applications and uses in thermal engineering, electronic cooling, and data centers.
Application Field of the ATS-06F-128-C3-R0
The ATS-06F-128-C3-R0 is a heat sink designed for a broad range of applications. It is an effective cooling and heat dissipation solution for high-end graphics cards, CPUs, hard disk drives, and other components which require efficient thermal control. The ATS-06F-128-C3-R0 series has a low contact resistance and a low profile design which makes it ideal for compact systems. It is also an effective cooling solution for multi-processor systems, servers, and blade enclosures. The ATS-06F-128-C3-R0 is suitable for a wide range of electronic equipment which require efficient heat dissipation.
Working Principle
The working principle of the ATS-06F-128-C3-R0 is based on the principles of conduction and convection. In conduction-based heat transfer, heat is transferred from one element to another via direct contact. This is the most common method of heat transfer in most electronics. The ATS-06F-128-C3-R0\'s unique design facilitates this type of heat transfer with its high thermal conductivity and low contact resistance. The heat sink features a low profile design that allows for efficient heat transfer and low noise levels.
In addition, the ATS-06F-128-C3-R0 also utilizes convection-based heat transfer in order to maximize its efficiency. Convection is the transfer of heat through a gas or liquid medium, and the ATS-06F-128-C3-R0 utilizes this method to dissipate heat away from the surface of the electronic component. The heat sink features a large surface area which maximizes the amount of heat that can be dissipated. By using both conduction and convection-based heat transfer, the ATS-06F-128-C3-R0 is able to effectively and quickly dissipate heat away from the surface of the component. This ensures that the component stays cool and operating at peak efficiency.
Conclusion
The ATS-06F-128-C3-R0 is an advanced heat sink specifically designed for a variety of thermal engineering, electronic cooling, and data center applications. The ATS-06F-128-C3-R0 features a low profile design and a high degree of thermal conductivity that facilitate efficient conduction-based heat transfer. In addition, the heat sink also utilizes convection-based heat transfer in order to maximize its efficiency. This ensures that it is an effective cooling and heat dissipation solution for high-end electronic systems. Thanks to its efficacy and superior design, the ATS-06F-128-C3-R0 is a major market leader in the field of thermal management.
The specific data is subject to PDF, and the above content is for reference