| Allicdata Part #: | ATS-06F-133-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-133-C3-R0 |
| Price: | $ 6.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-133-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.77206 |
| 30 +: | $ 5.45118 |
| 50 +: | $ 5.13047 |
| 100 +: | $ 4.80986 |
| 250 +: | $ 4.48920 |
| 500 +: | $ 4.16855 |
| 1000 +: | $ 4.08839 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-06F-133-C3-R0 is a thermal heat sink that has proven itself a reliable choice for providing temperature control of electronic components or other heat-generating products. It is typically mounted onto the back side of the object to be cooled in order to dissipate heat away from the object by supplying air cooling. Heat sinks are typically made up of metal or other heat-conducting material such as aluminum, copper or a polymer, and usually contain fins or other surface features to increase the surface area available for cooling.
When it comes to the ATS-06F-133-C3-R0, its design is particularly useful in two different application fields: industrial manufacturers and electronics. In industrial manufacturing, it is usually used to control the temperature of large machinery such as presses and lathes in order to enable an optimal working environment for operators. In electronics, it is primarily used to keep electronic components, such as microprocessors or transistors, from overheating.
The ATS-06F-133-C3-R0 thermal heat sink works by dissipating heat away from the object or system it is mounted to using a combination of surface features – such as fins – and air circulation. The heat generated by the system or component is first collected by the heat sink’s fins. The fins then conduct the heat away from the component, which creates a “cold” side of the heat sink. This creates an area of increased pressure, caused by the warm air attached to the heat sink. The increased pressure then acts to pull in air from outside, providing a natural cooling effect.
Aside from its primary application fields and working principle, there are several other aspects of the ATS-06F-133-C3-R0 that make it a reliable choice. For starters, it is designed to work with a wide range of systems, making it versatile in the fields of both industrial manufacturing and electronics. Additionally, the low profile of the heat sink means that it can easily fit into tight spaces. Furthermore, it is designed to be “pin-free,” meaning heat can be dissipated easily with no risk of short-circuiting the system.
The ATS-06F-133-C3-R0 is an effective thermal heat sink that can prove invaluable when it comes to temperature control of electronic components and other systems. Its versatile design, combined with its simple working principle, makes it a reliable choice for a range of uses. With its ability to fit into tight spaces, perform reliably without short-circuiting, and provide an effective cooling effect, the ATS-06F-133-C3-R0 can be used to advantage in a range of industrial and electronic applications.
The specific data is subject to PDF, and the above content is for reference