ATS-06F-143-C1-R0

Thermal heat sinks are integral components of most digital electronics. From computers and laptops to portable devices, thermal heat sinks are responsible for controlling temperature fluctuations and ensuring proper functioning of these devices. ATS-06F-143-C1-R0 is a thermal heat sink, made from aluminum, that is designed to manage excessive heat generated by electronic components. In this article we will explore the application field and working principle of ATS-06F-143-C1-R0.

ATS-06F-143-C1-R0 is a small yet powerful heat sink. It measures 134.0mm (L) x 95.5mm (W) x 36.5mm (H). It is constructed from aluminum alloy and has a pre-applied thermal interface material to help with the conduction of heat away from the device. ATS-06F-143-C1-R0 is designed to dissipate a maximum of 41W/m2 of heat from the device using natural convection cooling. It is specifically designed to be used in high temperature applications up to 85C and is certified to UL 746 and IEC 60512.

The primary application field of ATS-06F-143-C1-R0 is in thermal management of digital electronic components and it is particularly useful in reducing excessive heat. It is particularly designed to be used in applications such as servers, enclosed drives, communication systems, consumer electronics, electric vehicles, and renewable energy applications such as solar cells. ATS-06F-143-C1-R0 is designed to offer reliable and flexible solutions to thermal issues in electronic components.

The working principle of ATS-06F-143-C1-R0 is simple. The device has an aluminum alloy body with an integrated thermal pad in between the two layers which helps heat to be conducted away from the component. This thermal pad helps to distribute the heat through the entire aluminum alloy body. After the thermal pad absorbs the heat from the device, the aluminum alloy body helps to dissipate the heat in the ambient air using natural convection. This natural convective airflow occurs through the thermal layers due to the temperature gradient between the device and the ambient air.

In terms of performance, ATS-06F-143-C1-R0 is designed to dissipate a maximum of 41W/m2 of thermal power. This performance is further enhanced with the presence of the integral thermal pad which helps with better heat conduction. As such, ATS-06F-143-C1-R0 is an efficient and reliable choice for thermal management.

In conclusion, ATS-06F-143-C1-R0 is an efficient thermal heat sink, designed for applications involving high temperature electronic components. It is constructed from aluminum alloy and has an integrated thermal pad. This helps to conduct heat away from the device while the aluminum alloy body dissipates it using natural convection. Furthermore, ATS-06F-143-C1-R0 is designed to dissipate a maximum of 41W/m2 of thermal power, thereby making it an efficient and reliable choice for thermal management.