| Allicdata Part #: | ATS-06F-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic system. Without adequate cooling, electronic components such as processors, transistors, and circuits will overheat, ultimately leading to component failure. The ATS-06F-16-C3-R0 is a heat sink designed to provide superior cooling performance and reliability by efficiently transferring heat away from sensitive electronic equipment. As such, it is a popular choice for use in a wide variety of applications that require reliable thermal management.
The ATS-06F-16-C3-R0 thermal heat sink features 16 individual fins, each measuring 0.6mm in thickness and arced inward to maximize surface area for efficient heat dissipation. The design also incorporates superior thermal conductivity materials such as aluminum alloy and copper which provide premium heat transfer capability and durability. On the underside of the sink, a precisely engineered “spine” helps to channel heat away from the connected electronic components, further improving the overall cooling performance.
ATs-06F-16-C3-R0 is designed for easy installation, with its slim profile it takes up minimal space and allows for tight fitting requirements that are common in many electronic systems. The thermal heat sink is also strong and durable and can withstand extreme temperatures up to 150C. ATS-06F-16-C3-R0is most commonly used in applications that require high thermal performance such as servers, high-performance processors, microprocessor-relate applications, high-performance motor controllers, and more. Its reliable cooling capabilities and easy installation make it an accessible, efficient choice for any system in need of superior thermal management.
The ATS-06F-16-C3-R0 thermal heat sink is highly efficient in transferring heat away from electronics, cooler operating temperatures increase energy efficiency and component lifespan, ultimately resulting in greater system reliability. Its heavy-duty construction and slender design make it a perfect fit for a variety of applications, providing the optimal cooling performance necessary for reliable electronic performance. With its superior capabilities ATS-06F-16-C3-R0 is an ideal thermal management solution for any system requiring reliable, optimized cooling performance.
The specific data is subject to PDF, and the above content is for reference