
Allicdata Part #: | ATS-06F-171-C1-R0-ND |
Manufacturer Part#: |
ATS-06F-171-C1-R0 |
Price: | $ 3.42 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X20MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.11472 |
30 +: | $ 3.03051 |
50 +: | $ 2.86209 |
100 +: | $ 2.69375 |
250 +: | $ 2.52542 |
500 +: | $ 2.44124 |
1000 +: | $ 2.18870 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to effectively manage the dissipation of heat generated by electronic devices. The ATS-06F-171-C1-R0 (hereon referred to as the ATS-06F) is a particularly effective finned heat sink, designed to be used in space-restricted areas.
The ATS-06F is manufactured from die-cast aluminum alloy and is designed to fit in a wide variety of electronic components and systems, including LEDs, power supplies, and other electronic equipment. Despite its small size, the ATS-06F has a high thermal conductivity and low thermal impedance, allowing it to effectively dissipate heat.
The ATS-06F consists of an aluminum plate fitted with a large number of finned aluminum extruded fins. The plate is designed to provide a flat surface to attach the heat sink, while the fins act to dissipate the heat from the component and improve the heat dissipation rate.
The ATS-06F works in a relatively simple way. When a device that generates heat is attached to the heat sink, the aluminum plate quickly absorbs the heat. The heat is then quickly transferred to the air surrounding the fins through conduction and convection. The air surrounding the fins is then immediately cooled, taking the heat away from the component and dissipating it into the atmosphere.
The ATS-06F is also designed to be used in a variety of applications. It can be used for direct-to-air or direct-to-air-conduction cooling, as well as for indirect-to-air or indirect-to-air-conduction cooling. It is also suitable for both static and dynamic cooling applications, and can be used in a variety of operating temperatures.
In addition to being used in conventional electronic applications, the ATS-06F has also found use in highly specialized applications such as laser diode cooling and active cooling systems for computers and servers.
The ATS-06F is a highly effective and reliable finned heat sink, with a large number of fin options to ensure the correct amount of heat dissipation for any application. It is easy to install, and requires minimal maintenance or upkeep.
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