| Allicdata Part #: | ATS-06F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-06F-20-C3-R0 thermal heat sink is a reliable and efficient heat dissipation device. It can be used to efficiently dissipate heat from large electronic components such as CPUs, GPUs, and other high power components. It is widely used in the IT, communications, electronics, and automotive industries.
The ATS-06F-20-C3-R0 thermal heat sink includes a base plate, a thermally conductive paste, and a metal cover. The base plate is made of aluminum and is designed to provide a strong base for all the components. The thermally conductive paste is a silicone based material with high thermal conductivity, which allows it to effectively draw heat away from the components and into the heat sink. The cover is made of metal and is designed to provide a barrier between the components and the environment.
The ATS-06F-20-C3-R0 thermal heat sink works by transferring heat from the components to the heat sink. Heat is transferred from the components to the heat sink via thermal conduction. The heat sinks are designed to maximize the heat transfer efficiency by providing a large surface area for the efficient dissipation of heat. The thermal conductive paste helps to further increase the efficiency of the heat transfer. The metal cover helps to protect the heat sink and components from the environment.
The ATS-06F-20-C3-R0 thermal heat sink is designed to be highly efficient and reliable. The thermally conductive paste provides an additional layer of protection against short circuiting and other potential damage. The metal cover is designed to provide an additional level of protection from the environment. The aluminum base plate is designed to provide a strong base for the components, while also helping to dissipate heat. The design of the ATS-06F-20-C3-R0 thermal heat sink allows it to be used for a variety of high power components, including CPUs, GPUs, and other devices.
The ATS-06F-20-C3-R0 thermal heat sink is a reliable and efficient heat dissipation device. Its efficient design allows it to effectively dissipate heat from a variety of high power components, while providing a high degree of protection from the environment. The thermally conductive paste increases the efficiency of heat transfer, while the metal cover helps to protect the components from the environment. The aluminum base plate provides a strong base for the components and helps to dissipate heat. In summary, the ATS-06F-20-C3-R0 thermal heat sink is an efficient and reliable heat dissipation device that is well suited for use in a variety of industries.
The specific data is subject to PDF, and the above content is for reference