| Allicdata Part #: | ATS-06F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management through heat sinks is a very important concept in engineering. The temperature of any electrical components can build up during operation. This can be detrimental to their longevity and performance. Heat sinks are typically used to dissipate the heat from the components so that they do not overheat and cause damage. The ATS-06F-200-C3-R0 is a widely used heat sink for cooling of electronics.
The ATS-06F-200-C3-R0 is a two-part heat sink with a base plate and a top plate. The base plate is made from either aluminum or plastic with a finned surface for efficient heat transfer. The plates are then joined by four screws to form a single unit. The base plate has hundreds of fins or “teeth” that are specially designed to increase the surface area in contact with the air. As air passes through the fins, it is heated by the base plate and cooled as it passes out. This creates a continuous circulation of heat that dissipates away from the electronics.
The ATS-06F-200-C3-R0 has an effective thermal resistance of 0.53-0.59 C/W. This specification depicts the ability of the heat sink to dissipate the heat from the components at the systems ultimate design temperature. It is important to consider this rating when selecting a heat sink for a given application. Generally, higher thermal resistance ratings are desired for efficient cooling performances.
The ATS-06F-200-C3-R0 is suited for a wide variety of applications, including industrial electronics, telecommunications, automotive and consumer electronics. It can be used to cool processors, transistors, power converters and many other components that generate heat. This makes it a very versatile product in the thermal management field.
The ATS-06F-200-C3-R0 also features a unique ‘dual-slot’ design, which helps to improve both heat transfer and air circulation. The design of the fin and the length of the assembly are optimized to deliver superior airflow and cooling performance. This makes it a great cooling solution for high density boards and power modules.
In conclusion, the ATS-06F-200-C3-R0 is a reliable and efficient thermal management device. Its high-quality aluminum base plate and unique fin design make it a great choice for cooling a variety of electronics. Its thermal resistance rating of 0.53-0.59 C/W allows it to provide superior cooling performance in a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference