| Allicdata Part #: | ATS-06F-204-C1-R0-ND |
| Manufacturer Part#: |
ATS-06F-204-C1-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-204-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.41°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component for thermal management in many electronic devices. The ATS-06F-204-C1-R0 heat sink is specifically designed for use in high-power operations, and it is used in the thermal management of a variety of electronic devices including power semiconductors. The ATS-06F-204-C1-R0 heat sink is a thermal management solution ideal for a wide variety of applications.
The heat sink is a pin-finned aluminum extrusion using a micro-fin, anodized surface. The integrated design of the ATS-06F-204-C1-R0 features enhanced surface area, high effective thermal conductivity, highly optimized fin structure, and excellent air convection capability in order to maintain excellent thermal management performance.
The ATS-06F-204-C1-R0 is a low-profile heat sink suitable for applications with limited height and space, making it suitable for use in a number of applications. And the pins of this heat sink maintained a 0.2mm distance precision, guaranteeing the stableness of the whole structure and the compatibility with different circuit boards.
The purpose of a heat sink is to transfer heat away from circuits or other components that produce it. The ATS-06F-204-C1-R0 does this by offering a large surface area with fins that increase the rate of heat dissipation. The aluminum construction and anodized surface also increase the thermal conductivity in addition to the fin structure. Another benefit of the ATS-06F-204-C1-R0 is that it provides increased air convection. The integrated design of the heat sink has a large surface area and closely spaced fins which provide a high rate of air flow for efficient cooling.
The ATS-06F-204-C1-R0 heat sink is highly compatible with many types of circuits. It has a low-profile design which makes it suitable for applications with limited space. It features an anodized surface and an optimized fin structure for excellent thermal performance. Its high rate of air flow provides efficient cooling, while its 0.2mm gap between the fins ensures a stable and reliable connection with circuit boards. This makes it an ideal choice for numerous thermal management or power semiconductor application.
The specific data is subject to PDF, and the above content is for reference