| Allicdata Part #: | ATS-06F-22-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-22-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-22-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are one of the most widely used components in the development and fabrication of electronic systems. They can be used in a wide variety of applications, such as cooling power components, dissipating heat generated from the components, and regulating the temperature of the system. ATS-06F-22-C3-R0 is a thermal-heat sink that is designed to provide the necessary heat dissipation for certain devices. The ATS-06F-22-C3-R0 is an aluminum heat sink with a robust construction, high thermal conductivity, and dimensional stability.
The ATS-06F-22-C3-R0 has a number of features that make it an excellent choice for a variety of thermal management solutions. First, its aluminum construction makes it lightweight and thermally efficient. Additionally, its flat base and cylindrical body make it easy to fit into compact spaces. Furthermore, the ATS-06F-22-C3-R0 has an excellent thermal resistance, making it a great choice for cooling power components such as CPUs, GPUs, and other high-end chipsets. Moreover, its overall dimension and weight make it suitable for most applications.
The ATS-06F-22-C3-R0 works by drawing heat away from the active components and out into the ambient air. It uses a convectional cooling method to effectively dissipate the generated heat from the components. Its heat-pipe construction allows a large surface area to be exposed to the surrounding air, leading to a significant improvement in its cooling performance. Furthermore, its optimized airflow pattern ensures even and adequate cooling of all components within the system.
Another key advantage of the ATS-06F-22-C3-R0 is its compatibility with a range of popular mounting systems, such as Intel\'s Socket 478 and AMD\'s Socket 754. This allows for an easy and secure installation, and the ability to customize the heatsink to specific applications. Additionally, the ATS-06F-22-C3-R0 is designed to be highly reliable, with a long service life and minimal maintenance requirements.
In conclusion, ATS-06F-22-C3-R0 is an effective thermal-heat sink that is suitable for a range of thermal management solutions. Its aluminum construction and optimized design make it a lightweight yet efficient solution, with excellent thermal resistance and performance. Furthermore, it is compatible with a range of popular mounting systems, and is highly reliable with minimal maintenance requirements. All these factors make the ATS-06F-22-C3-R0 an ideal choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference