| Allicdata Part #: | ATS-06F-26-C1-R0-ND |
| Manufacturer Part#: |
ATS-06F-26-C1-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-26-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions, such as the ATS-06F-26-C1-R0, can ensure optimal temperatures for a variety of applications. The ATS-06F-26-C1-R0 is a heat sink designed to efficiently dissipate heat away from sensitive components, including semiconductor devices and other electronics. Heat sinks are essential components of any effective thermal management system, as they can help ensure that the equipment’s components are kept at a safe temperature.
Law of Heat Transfer
In order to understand the working principle of the ATS-06F-26-C1-R0, it is first important to become familiar with the laws of heat transfer. Heat energy is always transferred between surfaces of unequal temperature, with warm temperatures being transferred to colder temperatures. In the case of the ATS-06F-26-C1-R0, this means that heat is dissipated away from the components.
Heat is transferred in three primary ways: radiation, conduction, and convection. Radiation occurs when heat energy is transferred through Electromagnetic Radiation, while conduction occurs when heat is transferred through physical contact between two objects. Convection takes place when heat is transferred through the motion of fluids.
ATS-06F-26-C1-R0 Heat Sink
The ATS-06F-26-C1-R0 heat sink is designed to transfer heat away from components via conduction and convection. The heat sink’s fin structure allows it to maximize the surface area available for heat dissipation, which increases its efficiency. The heat sink’s materials are specifically chosen and tailored for optimal performance, which further increases its effectiveness.
The ATS-06F-26-C1-R0 is typically used for applications such as the cooling of semiconductor components, integrated circuits, and other electronics. It is designed to provide effective cooling while still maintaining light weight and compactness. This makes the ATS-06F-26-C1-R0 a cost-effective solution for a variety of cooling needs.
Conclusion
The ATS-06F-26-C1-R0 is an important component for a variety of thermal management solutions. Its finned design and tailored materials make it an effective way to dissipate heat away from components and maintain optimal temperatures. It is an ideal solution for cooling needs in applications such as semiconductor components and other electronics.
The specific data is subject to PDF, and the above content is for reference