| Allicdata Part #: | ATS-06F-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-06F-30-C3-R0 is a thermal – heat sink device that helps to dissipate large amounts of heat in an electronic system. This thermal – heat sink device typically includes a dissipating surface such as multiple stacked fins, a heat spreader and its associated circuitry, and a fan to move air across the device.
Application Field
The ATS-06F-30-C3-R0 is typically used in high-powered applications such as high-performance computer systems, avionics systems, or industrial machinery applications. It is especially well-suited for applications where cooling is a particularly important factor.
The ATS-06F-30-C3-R0 can be incorporated into an existing cooling system or can be used as a stand-alone heat sink. In stand-alone configurations, the ATS-06F-30-C3-R0 is often positioned in such a way so as to utilize natural air flow or to take advantage of other cooling methods such as forced air cooling or liquid cooling.
Working Principle
The ATS-06F-30-C3-R0 works by dissipating heat from the system into the environment. Heat is transferred from the device to its dissipating surface through heat conduction. The dissipating surface increases the surface area available for heat dissipation thereby increasing the amount of heat that can be dissipated. The fan draws in cool air from the environment and passes it over the dissipating surface, thus aiding in transferring more heat away from the device and ultimately into the air. This process can be further enhanced by the addition of a heat spreader which increases the heat conduction area of the heat sink.
The ATS-06F-30-C3-R0 also includes circuitry that enables it to control its fan speed and temperature in order to maintain optimal cooling performance. This circuitry can be used to fine-tune the cooling performance of the device according to the needs of the system.
The ATS-06F-30-C3-R0 is a highly efficient thermal – heat sink device that is suitable for high-powered applications where optimal cooling performance is a requirement. By utilizing a combination of efficient heat conduction, the ability to increase surface area for heat dissipation, and the ability to control its fan speed and temperature, the ATS-06F-30-C3-R0 can help keep high-powered electronic systems running at their peak operating temperature even under extreme conditions.
The specific data is subject to PDF, and the above content is for reference