| Allicdata Part #: | ATS-06F-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-06F-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are an extremely important part of the cooling systems of virtually any application where heat issues are a concern. The ATS-06F-40-C1-R0 heat sink is designed to provide an effective and efficient thermal solution that can be used across a wide range of integrated circuit platforms.
What is a Heat Sink?
A heat sink is a device that acts like a radiator and conducts heat away from where it is generated. It can also provide a passive cooling solution by dissipating the heat from the source to the atmosphere. Heat sinks are commonly used on electronic components such as chips, CPU\'s and graphics cards, as well as various other electronics.
ATS-06F-40-C1-R0 Heat Sink
The ATS-06F-40-C1-R0 heat sink is a low profile, natural convection-cooling device suitable for a variety of systems. It is designed for larger chips and processors, as well as a few selected microprocessor packages. Its low profile design reduces interconnects and the required mounting height. The natural convection design provides superior cooling performance with a low fan sound-level.
ATS-06F-40-C1-R0 Applications
The ATS-06F-40-C1-R0 is suitable for a range of CPUs, Power Amps, Automotive Electronics or other high power applications. It is designed for use in applications where space is limited or where conventional fan cooling cannot provide the required cooling. It is effective in cooling high-speed processor circuits, such as audio amplifiers, microprocessors, as well as other high power ICs.
Working Principle
The ATS-06F-40-C1-R0 heat sink has a natural convection design which uses natural air movement to cool down the component. This means that the air is pulled into the fan and circulated around the heatsink. The air is then pushed back out and up to the external environment. This process cools the component by dissipating heat into the atmosphere.
The ATS-06F-40-C1-R0 heat sink is designed to provide superior performance in the widest range of environments. It has a forced air design that allows higher and faster heat transfer, as well as improved cooling. Its low profile design also increases the available space for components on the board. The heat sink also offers a fanless and noise free operation, which is ideal for most applications.
Conclusion
The ATS-06F-40-C1-R0 is a low profile, natural convective heat sink designed to provide effective and efficient cooling performance for a wide range of integrated circuit platforms. It is suitable for a variety of applications—including CPUs, power amps, and automotive electronics—where space is limited or fan cooling is inadequate. The fanless design offers noise-free operation, while the natural convection design ensures superior heat transfer. The low profile design increases board space and reduces interconnects.
The specific data is subject to PDF, and the above content is for reference