| Allicdata Part #: | ATS11718-ND |
| Manufacturer Part#: |
ATS-06F-69-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-69-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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;ATS-06F-69-C2-R0 Thermal - Heat Sinks Application Field and Working Principle
Thermal - Heat Sinks are devices used to dissipate heat from electronics, lasers, and other sensitive components. They are used to increase the efficiency of the components and lower the internal operating temperatures of the components. ATS-06F-69-C2-R0 is a type of heat sink which can be used in various applications of industrial, consumer, medical and defense applications.
ATS-06F-69-C2-R0 is thermally efficient aluminum heat sinks. It comes in the shape of a rectangle and has a total thickness of 0.06 inches and a total height of 0.69 inches. The heat sink has two large fins which cover a large area on the top side and it also has fins on the sides and bottom. The thermal design of the ATS-06F-69-C2-R0 is optimized for a combination of convection and radiation heat dissipation. The thermal characterization of the heat sink is very important so that it can be used accurately and safely in applications.
The applications of ATS-06F-69-C2-R0 range from Industrial and Medical applications, where it is used for cooling of semiconductors, circuit boards, motors, control systems, and many other electronics. It is also used in the Automotive and Defense industries where it is used to dissipate heat from electronic components and systems. The applications of ATS-06F-69-C2-R0 also include consumer electronics products like computers, laptops, digital cameras, audio and video equipment, and many other electronic devices.
The working principle of ATS-06F-69-C2-R0 is based on the use of a heat sink package in combination with a thermal interface material. The thermal interface material is used to fill the gap between the heat sink and the component to be cooled. This helps with the effective transfer of the heat from the component to the heat sink. The heat is then dissipated to the environment by the exchange of thermal energy between the package and the surroundings.
The aluminum construction of the ATS-06F-69-C2-R0 makes it light weight and highly thermally efficient. The aluminum also provides good thermal conductivity for the heat to be dissipated quickly into the environment. The fins on the sides and bottom also help to increase the surface area so that more thermal energy can be removed. The high performance and lightweight design make the ATS-06F-69-C2-R0 an ideal choice for high power applications as well as applications involving large heat loads.
In conclusion, thermal - heat sinks like the ATS-06F-69-C2-R0 are an essential component for efficiently dissipating heat from sensitive components. Their lightweight and highly thermally efficient design make them well suited for a wide range of industrial, consumer, medical and defence applications. As they offer effective thermal transfer, they can help increase the efficiency of the components and lower their operating temperatures, resulting in more reliable performance and longer product lifetimes.
The specific data is subject to PDF, and the above content is for reference