| Allicdata Part #: | ATS-06F-95-C3-R0-ND |
| Manufacturer Part#: |
ATS-06F-95-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06F-95-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a specialty technology designed to effectively dissipate heat generated by components in electronic or electromechanical systems. This technology is increasingly used in modern electronics due to its efficiency and reliability in preventing component malfunctions from overheating. One of the products of this technology is the ATS-06F-95-C3-R0 Heat Sink, a highly efficient heat dissipation system that is widely used in various applications.
The ATS-06F-95-C3-R0 Heat Sink consists of an aluminum plate that is thermoformed with a thin copper insert that is mounted to a plate containing the ATS-06F-95-C3-R0 heatsink elements. The plate is then fit into an enclosure with a fan to provide physical protection and also cooling. The ATS-06F-95-C3-R0 Heat Sink is able to dissipate temperatures of up to 100°C and is able to dissipate a power of up to 500 W.
The ATS-06F-95-C3-R0 Heat Sink is suitable for use in all modern electronics and military applications. This device is particularly useful in areas where high temperatures are expected. The thermal management technology used in the ATS-06F-95-C3-R0 Heat Sink is highly efficient, being able to dissipate heat with minimal turbulence and with minimal variation in air temperature. This technology is also highly reliable, ensuring that components will not suffer any damage from overheating.
Additionally, the ATS-06F-95-C3-R0 Heat Sink is extremely versatile. It can be used in any application where heat dissipation is a concern, including amplifiers, computers, video cards, aircraft, and medical electronics. This device also offers excellent protection against electrochemical corrosion, making it an excellent choice for long-term deployments and outdoor environments.
The working principle of the ATS-06F-95-C3-R0 Heat Sink is based on the process of heat conduction. This process involves transferring heat away from the component that is generating the heat. This process is facilitated by a thin sheet of metal which is connected to the ATS-06F-95-C3-R0 Heat Sink. This metal sheet serves as the surface from which heat is transferred from the component to the heatsink itself. The heat sink then dissipates this heat away using air or other fluid, depending on the specific application.
The ATS-06F-95-C3-R0 Heat Sink is an invaluable tool for modern thermal management systems. This device is highly efficient and reliable, and offers excellent protection against corrosion and turbulence. It is also highly versatile, making it suitable for a wide range of applications. This device is an ideal choice for any application where heat dissipation is a concern.
The specific data is subject to PDF, and the above content is for reference