| Allicdata Part #: | ATS-06G-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-06G-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06G-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an integral part of any electronic device, and the ATS-06G-117-C1-R0 is no exception. This particular heat sink is designed specifically to provide thermal management and dissipation for a wide variety of applications in the computer and consumer electronics industries. The ATS-06G-117-C1-R0 is made with an aluminum base and copper rods that are placed in an array of radiating fins to maximize heat transfer in all directions.
An array of heat sinks is typically used in order to dissipate the heat generated by high-powered processor chips. This particular heat sink uses a copper heat pipe to transfer the heat from a hotter component to a more efficient cooling area. The aluminum base helps to dissipate the heat in all directions, while the copper rods in the array of radiators absorb and dissipate the heat further from the processor. This array of radiators allows for efficient cooling of the processor, while also providing superior thermal performance for the device.
The ATS-06G-117-C1-R0 is designed to work in a variety of temperature ranges and conditions, including the most extreme environments. This allows for efficient thermal management in any environment, whether indoors or outdoor. The heat sink is also designed to provide superior heat transfer performance, helping to keep the processor running cooler and at peak performance.
The ATS-06G-117-C1-R0 also has the ability to adjust its cooling speed, providing the flexibility needed for heavy workloads and temperatures. This feature helps to provide an appropriate level of thermal management for any load or application, ensuring that the processor remains cool even when undergoing intense and sustained usage. This heat sink also has the ability to effectively dissipate the heat it absorbs, allowing the processor to remain in a safe operating temperature range.
The ATS-06G-117-C1-R0 has the capability to be installed in almost any system, and it is also compatible with a wide range of other common components, such as fans and cooling blocks. This makes it an ideal choice for anyone looking to provide their system with the best thermal management and cooling performance possible. Overall, the ATS-06G-117-C1-R0 is one of the best thermal management solutions available, providing superior heat transfer performance and cooling flexibility.
The specific data is subject to PDF, and the above content is for reference