ATS-06G-135-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11797-ND

Manufacturer Part#:

ATS-06G-135-C2-R0

Price: $ 7.57
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06G-135-C2-R0 datasheetATS-06G-135-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.81030
10 +: $ 6.43419
25 +: $ 6.05581
50 +: $ 5.67743
100 +: $ 5.29887
250 +: $ 4.92040
500 +: $ 4.82577
1000 +: $ 4.73114
Stock 1000Can Ship Immediately
$ 7.57
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Application Field and Working Principle of ATS-06G-135-C2-R0

Heat sinks are an important type of thermal management device. They are used to transfer heat away from hot components and to other surfaces. The ATS-06G-135-C2-R0 heat sink is one of the most advanced types of heat sinks available on the market. It is designed to provide efficient and effective thermal management solutions for a wide variety of electronic components and products.

This heat sink utilizes advanced technology and materials to reduce heat buildup and improve performance. Its features include a combination of aluminum fins with high-temperature silicone rubber gaskets that increase heat dissipation efficiency. The aluminum fins offer excellent conductivity and diffusivity of heat. The silicone rubber gaskets provide an excellent resistance to oxidation and thermal damage. The ATS-06G-135-C2-R0 offers optimal heat dissipation by utilizing its unique design.

The ATS-06G-135-C2-R0 heat sink is most commonly used in electronic components and products that require an efficient and effective thermal management solution. It is especially designed for power supplies, power transistors, heat dissipating solutions, and other high powered components. It can also be used in applications that require low thermal resistance, such as industrial equipment and automotive applications.

The ATS-06G-135-C2-R0 heat sink is designed to work with air as its medium for heat transfer. This ensures that optimal heat dissipation is achieved. The heat sink utilizes an advanced air convection design that reduces air turbulence for higher levels of cooling efficiency. The fins house an array of fan blades that create an optimal level of airflow over the surface of the fins. This increased airflow helps to dissipate heat away from the component.

The working principle of the ATS-06G-135-C2-R0 heat sink is based on the use of convection currents. Air is forced through the fins via the fan blades. As the air passes through the fins, it absorbs heat from the components and carries it away from them. As the air moves away from the components, it is cooled and then rises up, allowing hot air to exit the heat sink.

In conclusion, the ATS-06G-135-C2-R0 heat sink is an ideal thermal management solution for a variety of electronic components and products. Its advanced design and materials offer superior levels of efficiency and performance. The advanced air convection design allows for optimal heat dissipation, while the fan blades ensure a controlled and efficient airflow over the surface of the fins. Its working principle is based on convection currents which enable optimal heat dissipation via the movement of air.

The specific data is subject to PDF, and the above content is for reference

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