| Allicdata Part #: | ATS-06G-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-06G-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06G-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a must in many electronics applications. They serve as a way to protect components from the damage caused by heat and allow them to operate under optimal conditions. The ATS-06G-16-C1-R0 is a thermal device designed to be used in all types of electronic applications. It is constructed from high quality aluminum alloy and features a pre-formed surface that offers greater heat dissipation than most standard heat sinks.
The ATS-06G-16-C1-R0 heat sink is designed to provide cooling for applications which run at higher temperatures and require additional air circulation to help prevent overheating. It is ideal for power supplies, amplifiers, microprocessors and other high heat generating electronics. With the help of its airtight bonding surface, the ATS-06G-16-C1-R0 is able to dissipate heat efficiently and effectively even at high temperatures.
The ATS-06G-16-C1-R0 heat sink can be used in both natural convection and forced convection cooling applications. In the former, it relies on natural air currents in the enclosure housing the device to draw out the hot air that is naturally created when the device is running. In forced convection, a cooling fan is used to force air into the enclosure which then forces the heat outside. The ATS-06G-16-C1-R0 can be used with either method, providing additional cooling capacity.
The ATS-06G-16-C1-R0 heat sink is designed to dissipate heat through two heat paths – an inner and an outer one. The inner heat path leads the heat from the device to the cooling fins, while the outer heat path is responsible for transferring the heat from the cooling fins to the surrounding area. Thanks to the bonding surface, the heat is also spread out evenly over the fins. This ensures the sink can cool effectively even at high temperatures.
The ATS-06G-16-C1-R0 is also designed to be used with a variety of cooling methods, including air or liquid cooling. In air cooling, the heat sink is mounted in the enclosure or on a chassis, with the heat being drawn away from the fins into the surrounding air. In liquid cooling, the heat is dissipated into the liquid which is then pumped through the system and out of the heat sink.
The ATS-06G-16-C1-R0 is a highly effective thermal device and is ideal for applications where a high level of performance is required at high temperatures. Its pre-formed aluminum alloy construction ensures the device performs optimally even in harsh environments. With its airtight bond and efficient heat dissipation, the ATS-06G-16-C1-R0 is able to help maintain stability in electronics by cooling components effectively.
The specific data is subject to PDF, and the above content is for reference