ATS-06G-164-C1-R0

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Introduction

Heat Sinks are devices designed to dissipate heat from an electrical component, usually an integrated circuit, and disperse it into the ambient environment. Heat sinks are often relatively large metal components mounted on top of an electronic component or system, and provide additional surface area to facilitate the transfer of heat away from the component. The ATS-06G-164-C1-R0 is a type of Heat Sink used to dissipate electrical power in a wide range of applications. In this article, we will discuss the ATS-06G-164-C1-R0’s typical application fields and its operating principles.

Application Field

The ATS-06G-164-C1-R0 is a general-purpose Heat Sink designed to perform in a variety of applications, including consumer electronics, commercial electronics, industrial electronics, audio and visual equipment, and telecommunications. This type of Heat Sink is also ideal for applications where space is at a premium, as it features a spacious mounting surface comprising four independent, interlocking aluminum fins.

The ATS-06G-164-C1-R0’s low profile construction also makes it ideal for use in slimline enclosures, where conventional heat sinks may not be suitable due to space restrictions. It features four integral mounts for ease of installation, with an external width of 164mm, a height of 12mm and a depth of 64mm.

The ATS-06G-164-C1-R0 has a thermal resistance of 0.092°C/W, which is suitable for a wide range of applications. It is capable of dissipating up to 4W of power, making it well suited to use in high power devices, such as in the power supply of computers and other equipment.

Working Principle

The ATS-06G-164-C1-R0 works by transferring heat away from heat-generating electronic components. Its four integral aluminum fins aid in the transfer of heat away from the component, with each fin’s finned surface area increasing the exposed area of the heat sink. The fins also provide greater surface area for heat transfer, which increases the overall cooling potential of the Heat Sink.

The ATS-06G-164-C1-R0 is designed with a simple mounting system, with four integral mounting holes that facilitate the use of spring-loaded screws. This enables the Heat Sink to be securely attached to the component or device. The Heat Sink also features four grooves in its surface for the ease of air circulation, allowing air to flow through and around the Heat Sink.

The ATS-06G-164-C1-R0 also features a Thermal Conductive Interface (TCI) system, which increases the overall heat transfer capability of the Heat Sink. The TCI system uses an integrated circuit to transfer heat generated by the component or device to the Heat Sink, making it more effective in dissipating heat away from the component. The TCI system also increases the lifetime of the Heat Sink, making it more reliable in the long run.

The ATS-06G-164-C1-R0 is also designed to function with minimal airflow, allowing for a more efficient control over the temperature of components. As a result, components and devices that utilize this type of Heat Sink can more easily operate within their designed temperature ranges, improving their performance and longevity.

Conclusion

The ATS-06G-164-C1-R0 is a general-purpose Heat Sink designed to efficiently dissipate heat away from electrical components in a wide range of applications. It features four interlocking aluminum fins that increase its surface area for heat transfer, and its simple mounting system makes installation easy. The ATS-06G-164-C1-R0 also features a Thermal Conductive Interface (TCI) system, which further improves its heat transfer capabilities.

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