| Allicdata Part #: | ATS-06G-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-06G-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06G-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a vital component of any electronic system, and ATS-06G-170-C3-R0 is among the most popular models available. As a thermal-heat sink, it offers a high quality solution for removing heat generated by electronic products. This article will discuss the application field and working principle of the ATS-06G-170-C3-R0.
The ATS-06G-170-C3-R0 is designed for applications that require cooling in a wide range of temperatures. It is capable of dissipating heat efficiently, and is effective over a broad temperature range. It is suitable for use in a variety of industrial and consumer-oriented applications, such as LED lighting, electronics cooling, semiconductor processing, and medical equipment cooling. Generally, the ATS-06G-170-C3-R0 is used in applications where the temperature is expected to reach temperatures higher than normal.
The ATS-06G-170-C3-R0 is an active type of cooling system, meaning it uses a fan or other active component to help move the heat away from the application. The thermal-heat sink consists of a base plate, a fan, and an array of cooling fins. The base plate serves as a platform for attaching the heat sink to the application, and the fan forces air through the cooling fins to dissipate the heat. The cooling fins form an integrated component of the heat sink, and are responsible for absorbing and dissipating the heat away from the application. The fin design of the ATS-06G-170-C3-R0 is optimized for efficient heat removal over a wide range of temperatures.
The ATS-06G-170-C3-R0 is capable of handling a variety of cooling requirements. It is effective at removing heat from a wide range of electronic components, including LED lighting, semiconductor devices, and medical devices. Thanks to its fan, the ATS-06G-170-C3-R0 can also be used for active cooling applications, such as active cooling enclosures and industrial chillers. The fan can be tailored to the exact cooling requirements of the application, and the fan speed can be adjusted to achieve the desired cooling levels.
The ATS-06G-170-C3-R0 is a reliable and efficient thermal-heat sink solution for a variety of applications. Its wide range of uses ensures it is suitable for use in a variety of commercial and industrial applications. Thanks to its fin design and active cooling capabilities, the ATS-06G-170-C3-R0 can easily and effectively remove the heat from electronic components and equipment.
The specific data is subject to PDF, and the above content is for reference