| Allicdata Part #: | ATS11910-ND |
| Manufacturer Part#: |
ATS-06G-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06G-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are one of the most important components in the thermal management of electrical and electronic systems. Their primary purpose is to remove heat generated by the operation of electronic components to ensure the system\'s reliability and longevity.
ATS-06G-63-C2-R0 is a type of heat sink designed for cooling medium to high-power applications. It is a compact and lightweight heat sink made from aluminum and comes with a unique fin structure to allow efficient heat dissipation. The heat sink has a range of air flow from 0.1m/s to 0.8m/s and a maximum temperature that can be reached by passing air across its fins of up to 67 degrees Celsius. The product also has a good mounting system that ensures the heat sink stays secure and stable, even during high-power applications.
Applications of ATS-06G-63-C2-R0 Heat Sink
The ATS-06G-63-C2-R0 heat sink is primarily designed for medium to high-power applications. It is suitable for use in power supply units, telecommunications, automotive, general electronics and military applications. The heat sink is also suitable for elements subject to large variations in temperature such as IGBTs, FETs and PID controllers.
Working Principle of ATS-06G-63-C2-R0 Heat Sink
The working principle behind the ATS-06G-63-C2-R0 heat sink is based on the fact that heat is released from the heated surface and then transformed into the surrounding air through radiation and convection. The heat sink’s aluminum fins increase the surface area when compared to a conventional heat conductive material, allowing more heat to be dissipated into the surrounding air.
The heat sink comes with a unique fin structure that works to draw in cold air at one end and out warm air at the other end. This helps to reduce the overall temperature of the heated surface, cooling the heat generated by the electronic components.
The efficiency and effectiveness of the heat sink are greatly improved by its mounting system. By keeping the heat sink securely and firmly in place, it can more effectively dissipate heat and allow for more efficient cooling, making it suitable for medium to high-power applications.
Conclusion
The ATS-06G-63-C2-R0 heat sink is an effective cooling solution for medium to high-power applications. It is lightweight, easy to mount and offers efficient heat dissipation thanks to its unique fin structure. This makes it an ideal choice for a range of applications, including power supplies, telecommunications, automotive electronics and military applications.
The specific data is subject to PDF, and the above content is for reference