| Allicdata Part #: | ATS-06G-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-06G-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06G-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks: ATS-06G-80-C3-R0 Application Field and Working Principle
A thermal - heat sink is a device used to reduce the temperature of certain components, circuits, or devices. Heat sinks are typically made of metal or other metals that can absorb and dissipate heat quickly. The ATS-06G-80-C3-R0 is a special type of heat sink designed to operate in extreme temperatures. Its purpose is to aid in the cooling of sensitive equipment in hazardous, high-temperature environments.
ATS-06G-80-C3-R0 Application Field
The ATS-06G-80-C3-R0 is an ideal heat sink for applications requiring up to 8000 Celsius (C) continuous temperature operations. This makes it suitable for use in the oil and gas industry, where temperatures can exceed 9000C in tight spaces. Its small size and low profile makes it suitable for areas with space constraints.
The ATS-06G-80-C3-R0 can also be used in electronics, such as integrated circuits and other high power semiconductor components. It can also be used to cool chipsets, memory chips, graphics processors, and computer processors, as well as many other electronic components. Additionally, it can be used for electrical and optical components, such as lasers and optical circuit components.
ATS-06G-80-C3-R0 Working Principle
The ATS-06G-80-C3-R0 uses a thermal conductive aluminum base plate to absorb heat from the device or circuit board. Heat is then dissipated by natural convection through the fins and into the surrounding environment. The fins are made of aluminum alloy, allowing for efficient heat flow and thermal stress relief.
The heat sink is very efficient at dissipating heat. Its design creates a great surface area to air interface for better cooling, a key component to its high temperature tolerance. Additionally, the fins are designed for maximum air movement contact, thereby assisting in cooling the device or circuit board.
The ATS-06G-80-C3-R0 also has a low profile design, allowing it to fit in most applications without the need for additional clearance. This low profile design has the benefit of reducing the total amount of heat generated and released, which is beneficial in many applications.
Conclusion
The ATS-06G-80-C3-R0 is a highly efficient thermal heat sink tailored for high temperature operations. Its aluminum alloy fins provide maximum air movement for cooling, and its low profile design helps to reduce the heat generated and released. This makes it ideal for oil and gas operations, and for cooling high power semiconductor and electronic components.
The specific data is subject to PDF, and the above content is for reference