ATS-06G-83-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-06G-83-C3-R0 Thermal - Heat Sinks Application Field and Working PrincipleThermal-heat sinks are a type of cooling device used in both electrical and mechanical systems. This type of device is used to reduce the temperature of a component or system by dissipating and/or dissipating heat away from it. The ATS-06G-83-C3-R0 is a type of thermal-heat sink from Aavid Thermalloy, designed to optimize the cooling of high power electronics and applications where maximum heat dissipation is needed.ApplicationsThe ATS-06G-83-C3-R0 is a popular choice for a variety of applications, including:1. Power electronics2. Automotive electronics3. Control and instrumentation4. Telecommunications 5. LED lighting6. Medical equipment7. Aerospace componentsThe ATS-06G-83-C3-R0 is a highly effective thermal-heat sink at optimizing the cooling of these application fields due to its efficient design and thermal properties. It is able to quickly and effectively cool down when exposed to hot environments.Working PrincipleThe ATS-06G-83-C3-R0 is designed to dissipate excess heat generated from the component or system that it is used with. This product utilizes the most advanced heat dissipation solutions including Heatpipe technology and high performance aluminum bases. This thermal-heat sink is also equipped with a patented barbell clip-frame assembly, which is designed to optimize heat transfer from the component to the heat sink.The Heatpipe Technology contained in the ATS-06G-83-C3-R0 absorbs heat from the components surface and carries it away. This heat is then dissipated into the air or ground via a fin-blade system on the surface of the device. The aluminum base of the device is designed to be as flat as possible, promoting maximum contact and heat transfer rates from the component.The patented barbell clip-frame assembly also allows for a uniform mounting pressure on the heat sink, allowing for a secure connection between the component and the thermionic device. This also promotes greater cooling performance and better thermal efficiency.ConclusionThe ATS-06G-83-C3-R0 thermal-heat sink is the perfect solution for cooling high-power electronics and other applications where optimal heat dissipation is needed. With its patented barbell clip-frame assembly and highly efficient Heatpipe Technology, this device is able to quickly and effectively dissipate heat away from the components and systems for which it is used. This thermal-heat sink is also designed with a flat aluminum base, for maximum contact and heat transfer rates.

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