ATS-06H-06-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11952-ND

Manufacturer Part#:

ATS-06H-06-C2-R0

Price: $ 3.89
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-06-C2-R0 datasheetATS-06H-06-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.54060
10 +: $ 3.44736
25 +: $ 3.35437
50 +: $ 3.16802
100 +: $ 2.98166
250 +: $ 2.79531
500 +: $ 2.70213
1000 +: $ 2.42260
Stock 1000Can Ship Immediately
$ 3.89
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.17°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-06H-06-C2-R0 Application Field and Working PrincipleHeat sinks are one of the most widely used and versatile components in the electronics industry. Their ability to dissipate heat away from sensitive components and other devices has made them an indispensable part of many applications and designs.The ATS-06H-06-C2-R0 is a heat sink that uses a combination of layers to effectively remove heat from sensitive components or devices. The ATS-06H-06-C2-R0 is made of aluminum and features an open-fin design. Its construction allows for efficient heat exchange and dissipation.The first layer of the heat sink is a baseplate that has been extruded from high-grade aluminum. This baseplate provides structural integrity to the device and is designed to provide a solid heat transfer path between the component being cooled and the fins of the heat sink. The fins are linked to the baseplate with an integral bonding method that creates a strong bond between the two pieces.The second layer of the heat sink is a set of fins. These fins are specifically designed to maximize heat dissipation. The tall, thin shape of the fins allows air to flow freely between them, increasing their ability to disperse the heat away from the device being cooled. The fins also feature an air-gap design, which helps increase the convective cooling capabilities of the heat sink. This combination of features helps the ATS-06H-06-C2-R0 to effectively transfer heat from the components being cooled to the surrounding environment.The third and final layer of the heat sink is a protective cover. This cover is made of extruded aluminum and helps protect the fins from physical damage and corrosion. It also helps reduce the noise produced by the heat sink and ensures a long-lasting operation.The ATS-06H-06-C2-R0 is an excellent choice for applications requiring superior cooling performance. Its combination of layers and features make it a very effective heat sink, allowing it to efficiently dissipate heat away from delicate components or devices. It is easy to install and can be used in a wide variety of applications. It is a great option for those looking for superior performance and reliability.

The specific data is subject to PDF, and the above content is for reference

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