| Allicdata Part #: | ATS-06H-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-06H-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks, commonly used in the cooling of electronic components, are thermal management systems that aid in dissipating the heat generated by the components. The ATS-06H-10-C1-R0 heat sink is a type of heat sink specifically engineered for small and high-power applications. This article will explain the application field and working principle of this thermal management device.
The ATS-06H-10-C1-R0 heat sink is designed for two different types of application fields - cooling of high-power electronics and automotive applications such as mobile phones, tablets and personal computing devices. The application range is further navigable by choosing between a range of sizes and, depending on the requirements, different constructions can be selected.
The heat sink itself consists of an aluminum base plate, which acts as a heat spreader, and a cooling fin attached to it. The base plate and its fins form a heat spreader which provides a large surface area and hence a great degree of heat dissipation. Additionally, the heat sink features a copper heat-pipe, which eliminates hot spots and functions as an additional way of spreading the heat away from the components. The heat-pipe also helps to keep the temperature of the heat sink at a constant level.
As far as the working principle of this heat sink is concerned, the heat from the electronic components is first spread out from the base plate by the copper heat-pipe. This heat is then dissipated into the air by the cooling fins. Due to the large surface area of the fins, the maximum dissipation of heat is achieved. This heat is then transferred to the ambient air, resulting in the cooling of the components.
The ATS-06H-10-C1-R0 is an excellent heat sink for both small and high-power electronics. Its efficient design and construction allow it to extend the life of these components and keep them operating at optimal levels. Its wide range of applications makes it a suitable choice for all types of cooling requirements. Additionally, the copper heat-pipe ensures that the heat is spread away from the components and cools evenly. As such, it is an ideal choice for cooling various electronic components in different applications.
The specific data is subject to PDF, and the above content is for reference