| Allicdata Part #: | ATS11964-ND |
| Manufacturer Part#: |
ATS-06H-107-C2-R1 |
| Price: | $ 5.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-107-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.67460 |
| 10 +: | $ 4.54545 |
| 25 +: | $ 4.29332 |
| 50 +: | $ 4.04069 |
| 100 +: | $ 3.78813 |
| 250 +: | $ 3.53559 |
| 500 +: | $ 3.28304 |
| 1000 +: | $ 3.21991 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are designed to dissipate heat from a device in order to keep it at an optimal temperature. The ATS-06H-107-C2-R1 is one such device, which is used in the industrial applications and designed to increase the effective dissipation of heat. It works on the simple principle of conduction, convection and radiative heat transfer.
When a device is overheating, the ATS-06H-107-C2-R1 absorbs the heat and disperses it away from the device. This is achieved by using a combination of thermal-heat dissipation techologies, including conduction, convection and radiation. To ensure that it performs at its best, the thermal-heat sink needs to be kept in an environment that is free from dust and debris.
The ATS-06H-107-C2-R1 is constructed from solid aluminum material, which acts as the main heat conductor. This material has excellent heat conductive properties that help redirect any excess heat away from the device. The fins of the heat sink help to increase the surface and air exposure, allowing for increased heat transfer from the device.
When it comes to superior thermal-heat management, the ATS-06H-107-C2-R1 offers the highest level of performance. Its high-grade fins are designed to provide maximum heat dissipation capacity, allowing for reliable operation of industrial devices. Its internal design also helps to improve the overall performance of the device, ensuring that it operates efficiently and effectively.
The ATS-06H-107-C2-R1 is designed to be used in a range of environments, including extreme temperatures and high-speed environments. It is also capable of cooling down the components of the device quickly after prolonged use. This helps to reduce the risk of overheating, ultimately improving the longevity of the device.
In terms of applications, the ATS-06H-107-C2-R1 is suitable for use in industrial settings. It works for electronics, such as computers, servers, telecommunications systems, circuit boards, and other related electronic equipment. This device is also popular for medical and aerospace applications, due to its outstanding thermal-heat management.
The ATS-06H-107-C2-R1 offers a cost-effective solution for thermal-heat management in industrial and commercial settings. It works by absorbing the heat generated by the device, and dispersing it away efficiently and reliably. This makes it a great choice for situations where thermal-heat management is essential for the proper functioning of the device.
The specific data is subject to PDF, and the above content is for reference