| Allicdata Part #: | ATS-06H-109-C1-R1-ND |
| Manufacturer Part#: |
ATS-06H-109-C1-R1 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-109-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been a major topic of conversation for many industries in recent years. Heat sinks have long been a staple of the electronics industry, and the ATS-06H-109-C1-R1 is one of the best solutions currently available. This device is specifically designed to provide optimal cooling performance for applications that require intensive thermal energy dissipation.
The ATS-06H-109-C1-R1 is a type of heat sink that\'s made up of several parts. The main component of the unit is the thermal management unit (TMU), which is the device responsible for dissipating heat away from sensitive electronic components. The unit also includes a mechanical assembly that houses and secures the TMU, as well as a fin array that provides additional surface area to aid heat transfer.
Heat is dissipated from the TMU through a combination of convection and conduction. The first process, convection, occurs when air circulates around the device, carrying away heat. The second process, conduction, happens when the heat passes through physical contact with other objects, such as the fin array.
The ATS-06H-109-C1-R1 is specifically designed for use in electronics and computer components, where proper thermal management is critical in order to keep sensitive components functioning optimally. The device\'s small size and relatively low power consumption allow it to be used in a wide variety of applications, including industrial, automotive, and consumer electronics. It is an ideal solution for applications that require cooling efficiency without taking up too much space.
Another major advantage of the ATS-06H-109-C1-R1 is its low cost, making it an affordable option for a wide range of applications. The device is reliable and efficient, with a lifespan of up to 10 times longer than other comparable thermal management solutions. Additionally, the device is RoHS compliant, meaning that it is designed and manufactured to meet or exceed environmental regulations.
Overall, the ATS-06H-109-C1-R1 is one of the best solutions available for thermal management needs, providing a reliable and energy-efficient solution at an affordable price. The device\'s combination of convection and conduction cooling, along with its low power consumption and small size, make it an ideal choice for a variety of electronics and computer applications.
The specific data is subject to PDF, and the above content is for reference