| Allicdata Part #: | ATS-06H-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-06H-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the key elements of device performance and reliability. The ATS-06H-115-C1-R0 is a heat sink designed to be used for a variety of application fields in industries ranging from consumer electronics to automotive and industrial. It is designed to extract heat from a device, component, or system in order to increase the device’s efficiency, reliability, and lifespan. The thermal heat sink is able to keep devices or components performing at peak performance for longer periods of time.
The ATS-06H-115-C1-R0 features a copper heat spreader, heat pipe and aluminum fin structure. The copper heat spreader is made from a colored copper material, which allows special corrosion and thermal properties. This allows for the heat sink to be used in a wide range of applications, including those in harsh environments. Heat pipes attached to the heat spreader make direct contact with the device, and rapidly transfer the heat away. This helps to quickly decrease the temperature of the device or component and improve overall performance. The aluminum fins are joined to the heat pipes to increase the surface area available for the heat to be dissipated. This makes the heat sink much more effective in dissipating the heat from the device or component.
The ATS-06H-115-C1-R0’s unique design allows it to be used in a variety of applications and fields. It can be used in automotive, telecom, datacom, military, aerospace, consumer electronics, and medical equipment. The thermal heat sink can provide increased heat dissipation, which allows for longer lasting performance and reliability of the device or component. It helps to improve the efficiency of the device or component as well, which can in turn reduce energy costs for the system.
The ATS-06H-115-C1-R0’s working principle is based on the principle of thermal conduction. Thermal conduction is the transfer of energy from a hotter material to a cooler material until equilibrium is reached. In the case of the ATS-06H-115-C1-R0, the heat pipe is used to quickly remove the heat from the device or component and transfer it to the copper heat spreader. The copper heat spreader then disperses the heat away from the device and towards the aluminum fins. The aluminum fins further dissipates the heat to the surrounding ambient air, preventing the device or component from overheating.
The ATS-06H-115-C1-R0 provides a reliable and effective solution for thermal management in a wide range of applications. It is designed with a high performance heat extraction system to ensure that the device or component being cooled stays at optimal performance for extended periods of time. Its lightweight design makes it ideal for use in portable electronics and systems, while its durable construction ensures it can stand up to rough conditions in industrial applications. Thanks to its superior thermal heat extraction properties, the ATS-06H-115-C1-R0 thermal heat sink is an ideal solution for industrial, automotive, and consumer electronics applications.
The specific data is subject to PDF, and the above content is for reference