ATS-06H-121-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11980-ND

Manufacturer Part#:

ATS-06H-121-C2-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-121-C2-R0 datasheetATS-06H-121-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.56580
10 +: $ 3.47130
25 +: $ 3.37756
50 +: $ 3.18982
100 +: $ 3.00220
250 +: $ 2.81459
500 +: $ 2.72077
1000 +: $ 2.43931
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.48°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks is one of the most important components in today’s electronic designs. Heat Sinks are responsible for dissipating excess heat from components to prevent their overheating and damaging other components. One of the most widely used type of Heat Sinks are the ATS-06H-121-C2-R0.

The ATS-06H-121-C2-R0 is a highly efficient, low profile Heat Sink that is specifically designed for applications where space is at a premium. It is constructed from solid aluminum with precision machined cooling fins that significantly increase its thermal performance. It also features an integrated Heat Shield that offers additional thermal protection from external sources.

In terms of performance, the ATS-06H-121-C2-R0 is capable of transferring heat in excess of 165W within an ambient temperature of less than 50°C. This makes it an ideal choice for applications that include high-power components such as CPUs, GPUs, RAM and memories. It also has an extremely low profile, making it suitable for applications where there is limited space available.

Although the ATS-06H-121-C2-R0 is specifically designed for high-power applications, it can also be used in many other applications. This includes low-power applications such as filtration, flow control, power supplies and solar inverters. In addition, the Heat Sink can also be used in applications where its low weight and small size provide a significant advantage against its larger counterparts.

The ATS-06H-121-C2-R0 works on the principle of conduction. It draws heat away from the component it is attached to and efficiently dissipates it into the atmosphere. The heat is transferred from the component to the Heat Sink via conduction, where it is then dissipated by the efficient cooling fins. The Heat Shield, which is integrated into the design, also helps to reduce the amount of heat that can escape.

The ATS-06H-121-C2-R0 is a highly efficient Heat Sink that is capable of transferring heat away from components with efficiency in excess of 165W. It is ideally suited to high-power applications where its low profile and lightweight design make it the perfect choice. It can also be used in a variety of other applications such as low-power electronics and filtration. Its efficient cooling fins and integrated Heat Shield ensure that it can efficiently dissipate heat from the component it is attached to.

The specific data is subject to PDF, and the above content is for reference

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