ATS-06H-15-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-06H-15-C1-R0 Thermal Heat Sink is specifically designed to provide optimum cooling performance for a variety of electronic components and devices. This heat sink is composed of high-grade aluminum and designed with different fin arrays and heat dissipation. It is an ideal solution for applications where high-power density and high-temperature environments are present.

Applications

The ATS-06H-15-C1-R0 is used for a wide variety of applications requiring environmental protection and thermal management. It can be used to cool computers and electronic devices, medical, semiconductor and automotive applications, and power supplies. The aluminum construction is ideal for applications with limited space, as it provides optimal heat dissipation over a very small surface area.

Design Features and Construction

The ATS-06H-15-C1-R0 has a special design that allows for superior thermal conductivity and heat transfer. It is made from high-grade aluminum and is designed to dissipate heat quickly and efficiently across a wide area. The fin arrays are designed to have high thermal resistance, meaning they can transfer heat quickly from the device to the air. The unique design and construction of the heat sink helps to reduce operating temperatures and increase efficiency.

Thermal Performance

The ATS-06H-15-C1-R0 offers excellent thermal performance, allowing devices to remain cool and stable in high-power and high-temperature environments. It features a low thermal resistance that provides quick and efficient cooling performance, while also allowing for higher power densities. The aluminum construction provides excellent thermal resistance and also helps increase the lifespan of the components it is used to cool.

Working Principle

The ATS-06H-15-C1-R0 functions by transferring heat from the device to the air. It utilizes a special fin array on the unit that dissipates heat over a wide area, allowing for efficient cooling. The heat is then dissipated out of the unit, as the fan pulls the cold air from outside and pushes it through the fins, cooling the unit. The efficient design of the heat sink ensures optimum heat dissipation, and also helps to reduce the operating temperatures of the device.

Conclusion

The ATS-06H-15-C1-R0 Thermal Heat Sink is a great option for applications where optimal cooling performance and environmental protection are required. It is designed with high-grade aluminum and features special fin arrays that provide excellent thermal resistance and allow for higher power densities. The unit is also designed for efficient heat transfer and provides long-term protection to the components it is used to cool.

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