| Allicdata Part #: | ATS-06H-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-06H-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-06H-15-C3-R0 is a thermal-heat sink device, commonly used in many fields in order to dissipate heat collected from equipment or devices. This type of heat sink employs the laws of physics in order to conduct heat away from the source and dissipate it into the environment. Heat sinks are often used with electronic components, such as processors, video cards, and memory chips.
First, let\'s take a closer look at the composition of the ATS-06H-15-C3-R0. This particular model consists of a base, fin, and a fan. The base provides a flat heat dissipating surface, which is in contact with the component to be cooled. The fin is used to create an increased surface area for more efficient heat transfer between the base and the environment. The fan is used to blow air over the fin, resulting in greater cooling performance.
The application field and working principle of the ATS-06H-15-C3-R0 are quite simple. The heat sink, as mentioned before, collects heat from an electronic component and dissipates it into the environment. The same laws of thermodynamics apply here, as in any other case - heat travels from an area of higher temperature to an area of lower temperature. The larger the difference between the source and the environment, the faster the heat will travel.
In the case of the ATS-06H-15-C3-R0, the base of the device makes direct contact with the hot component, allowing heat to travel from the component to the base. The base then transfers the heat to the fin, which increases the surface area for heat radiation, exponentially increasing the efficiency of the heat transfer. The fan then blows air over the fin, increasing the cooling performance even more by increasing the temperature gradient from the assembly and the environment.
The ATS-06H-15-C3-R0 is thus capable of dissipating large amounts of heat, depending on its design, the size of the fan, and the size of the fin, making it a great choice for many applications, especially in the field of electronics. It is an excellent choice for use in computers, audio/video systems, data centers, and other places where efficient cooling of electronics is important. It is also widely used in many industrial applications, such as factory automation, welding, and laser systems.
The ATS-06H-15-C3-R0 is a great choice when selecting an effective thermal heat sink. Its simple design, effective operation, and ability to dissipate large amounts of heat make it a versatile cooling solution for many different applications. Whether it be used in computers, factory automation, or laser systems, the ATS-06H-15-C3-R0 can be trusted to keep electronics running smoothly and efficiently.
The specific data is subject to PDF, and the above content is for reference