ATS-06H-16-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS12022-ND

Manufacturer Part#:

ATS-06H-16-C2-R0

Price: $ 4.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-16-C2-R0 datasheetATS-06H-16-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.05090
10 +: $ 3.94443
25 +: $ 3.72506
50 +: $ 3.50608
100 +: $ 3.28690
250 +: $ 3.06777
500 +: $ 2.84864
1000 +: $ 2.79387
Stock 1000Can Ship Immediately
$ 4.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are thermal devices that transfer the heat generated by an electronic or mechanical device to a fluid medium, usually air or a liquid. Heat sinks are commonly used in computers, HVAC systems and industrial machines. An ATS-06H-16-C2-R0 heat sink is designed to improve the thermal performance of an electronic device by reducing the temperature of the device and its components.

Application Field

The ATS-06H-16-C2-R0 heat sink is most commonly used in applications involving high-powered electronics such as CPUs, GPUs, and chipsets. It is also used to cool other components such as power supplies, video cards, and other devices that generate a large amount of heat. Heat sinks of this model are also often used to cool high power transistors, diodes, and other semiconductor components.

Working Principle

The ATS-06H-16-C2-R0 heat sink is designed to provide improved thermal performance. It consists of an aluminum fin heat sink that is designed to dissipate heat and a fan that is responsible for cool air movement. The aluminum fins act as a large surface area that allows the heat from the device to move away from it more quickly than if the heat just remained on the device\'s own surface. The fan then draws in cooler air and sends it through the heat sink, where the aluminum fins quickly absorb the heat and dissipate it away from the device. The fan then repeats the process of bringing in cooler air to keep the device cool.

The specific data is subject to PDF, and the above content is for reference

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