ATS-06H-175-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS12039-ND

Manufacturer Part#:

ATS-06H-175-C2-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-175-C2-R0 datasheetATS-06H-175-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.57840
10 +: $ 3.48138
25 +: $ 3.28810
50 +: $ 3.09481
100 +: $ 2.90134
250 +: $ 2.70791
500 +: $ 2.51449
1000 +: $ 2.46614
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions have been used for many years to keep certain machinery and equipment running effectively and efficiently. In this regard, one of the most commonly used methods for application is the ATS-06H-175-C2-R0 heat sink. This thermal solution is designed to maintain optimal temperatures within various devices or components.

The ATS-06H-175-C2-R0 thermal heat sink was designed with all-aluminum construction. This construction is designed to both provide superior heat dissipation and promote lightweight transport and assembly. The design features several ridges that run parallel to each other and extend outward from a finished portion of the heat sink. These ridges allow for better airflow and dissipation of heat. The size and shape of the heat sink can vary depending on the application. Common sizes range from 3-7 inches in length.

The ATS-06H-175-C2-R0 thermal heat sink is typically used to cool industrial machinery, such as microprocessors, chipsets, and FPGAs. The heat sink\'s efficient design and construction allows for ultra-low thermal resistance, which is especially beneficial for high-power applications. This heat sink is also designed to be low profile, so it can be installed in many compact spaces. Additionally, this thermal solution can also be combined with other cooling methods, such as fans or air conditioners, to further increase its effectiveness.

In order to make use of the ATS-06H-175-C2-R0 thermal heat sink, it must first be installed. The installation process is relatively simple and can be completed with the proper tools. First, the heat sink must be placed on the component or device that needs cooling. The mounting screws should then be inserted into the mounting holes on the heat sink and tightened to ensure a strong connection. After the heat sink is securely attached to the component, the next step is to apply thermal paste to the surface. This paste helps to form a strong bond between the heat sink and the component, which can further increase the effectiveness of the cooling solution. After the thermal paste has been applied, the component should be connected to a power source and the heat sink should begin to cool the component.

The ATS-06H-175-C2-R0 thermal heat sink is an effective and efficient thermal solution. This heat sink is designed to keep industrial machinery running at optimal temperatures. The compact design makes it perfect for a wide variety of applications, allowing it to be installed in different types of spaces. Additionally, it can be used in combination with other cooling methods to further increase its effectiveness. Ultimately, the ATS-06H-175-C2-R0 thermal heat sink is an excellent choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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