ATS-06H-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06H-20-C1-R0-ND

Manufacturer Part#:

ATS-06H-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-20-C1-R0 datasheetATS-06H-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are among the most important components of an electronic system. They are necessary to ensure proper operation of the system, minimize energy losses, and maintain optimal working temperatures. This is especially true when it comes to system components that generate a lot of heat, such as processors.

The ATS-06H-20-C1-R0 application field and working principle are applicable to a number of industries, ranging from consumer electronics to industrial and medical equipment. It is a forced-air heat sink, which means that it is designed to be cooled by an air stream. It is comprised of a base and a number of fins that are spaced in order to maximize surface area exposed to the airflow. The fins are also configured to promote air turbulence, which helps the heat transfer from the device to the surrounding air.

The ATS-06H-20-C1-R0 is especially effective in applications requiring high heat dissipation, such as in high-performance processors and other components. It is designed to be used in both convection and conduction cooling systems, and is capable of maintaining lower operating temperatures even in the most demanding thermal loads. It is also designed to be easily mounted, and provides excellent vibration and mechanical shock absorption characteristics, making it ideal for harsh working environments.

The ATS-06H-20-C1-R0 combines both convective and conductive heat dissipation technologies. On the conductive side, the base of the heat sink is made of a durable metal such as aluminum or copper, which allows for optimum heat transfer to its fins. On the convective side, the heat sink itself is designed in such a way that air flow is maximized across the surface of the fins. This helps to rapidly transfer heat away from the device, resulting in improved system efficiency.

Additionally, the ATS-06H-20-C1-R0 can be integrated with various cooling solutions, such as fans, liquid cooling systems, and even heat pipes. This allows for further improvement in thermal performance, especially in high-performance computing systems. This makes the ATS-06H-20-C1-R0 an ideal solution for a variety of applications, including CPU cooling, GPU cooling, and other industrial and consumer electronics cooling applications.

In summary, the ATS-06H-20-C1-R0 offers excellent performance and reliability to a wide variety of applications. Its combination of conductive and convective heat dissipation technologies makes it an ideal choice for high-performance computing systems. It is designed to be easily mounted, and provides excellent vibration and mechanical shock absorption characteristics. The ATS-06H-20-C1-R0 can also be integrated with additional cooling solutions, making it a great option for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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