| Allicdata Part #: | ATS-06H-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-06H-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are essential elements of all modern electronic and electrical appliances. Without them, the performance of any given piece of equipment would be severely limited. The ATS-06H-20-C3-R0 heat sink is a cutting-edge, high-performance component that can provide superior heat management for a broad range of devices and applications. This article will discuss the application field and working principle of the ATS-06H-20-C3-R0 thermal heat sink.
The ATS-06H-20-C3-R0 thermal heat sink is designed to provide efficient heat dissipation for a wide variety of electrical and electronic applications. For instance, it can be used with printed circuit boards (PCBs) to absorb and dissipate the generated heat from onboard components, thereby ensuring optimal performance. It can also be used with high-power electrical devices such as television receivers, laser diode modules, power transistors and other parts where rapid heat dissipation is needed. The ATS-06H-20-C3-R0 heat sink is an ideal choice for high-power, ultra-fast applications, given its efficient cooling capabilities.
The ATS-06H-20-C3-R0 thermal heat sink consists of a base plate that is made of aluminum. Aluminum is a metal known for its thermal conductivity and cost efficiency, making it a popular choice for thermal management. The aluminum base plate features a series of fins that are arranged in a grid-like formation to provide maximum surface area for effective heat dissipation. These fins are coated with a special heat-conductive material such as heat-conductive silicone in order to increase the heat transfer rate. The ATS-06H-20-C3-R0 also features an active fan for forced air cooling.
The working principle of the ATS-06H-20-C3-R0 thermal heat sink is based on convection. Convection occurs when heated air rises, creating a natural circulation of air flow. This air flow helps to dissipate the heat generated by the onboard components, thereby preventing them from overheating. Upon contact with the base plate of the ATS-06H-20-C3-R0, the air is heated further and then moves up through the fins, cooling them down. The air is then expelled back into the ambient environment.
The ATS-06H-20-C3-R0 thermal heat sink is highly effective and efficient in cooling applications and can provide enhanced performance in a wide range of electrical and electronic devices. Its effective cooling capabilities are due to its aluminum base plate, heat-conductive coating, and active fan. Furthermore, its cost-efficiency makes it an ideal choice for thermal management solutions. Given its superior performance and cost-saving advantages, the ATS-06H-20-C3-R0 thermal heat sink is a great choice for applications demanding superior heat management.
The specific data is subject to PDF, and the above content is for reference