ATS-06H-202-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS12069-ND

Manufacturer Part#:

ATS-06H-202-C2-R0

Price: $ 4.14
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X6MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-202-C2-R0 datasheetATS-06H-202-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.76740
10 +: $ 3.66660
25 +: $ 3.46298
50 +: $ 3.25924
100 +: $ 3.05556
250 +: $ 2.85186
500 +: $ 2.64816
1000 +: $ 2.59723
Stock 1000Can Ship Immediately
$ 4.14
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.83°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for all electronic systems, and heat sinks are an important component of an effective thermal management system. One of the most common types of heat sinks is the ATS-06H-202-C2-R0. This product is used to dissipate heat from high-power components or assemblies. It is designed to provide an efficient heat transfer into the ambient environment.

The ATS-06H-202-C2-R0 is designed to be mounted directly onto the component that generates heat. It consists of a base plate made of aluminum alloy and fins that are connected to the base plate. The fins provide a large exposed area and are designed to increase the surface area, improving the heat transfer into the environment. The ATS-06H-202-C2-R0 also has a fan mounted on top for additional cooling. The fan helps to draw in more air and move the air around the fins, further enhancing heat dissipation.

This product is typically used to cool components such as processors, transistors, or integrated circuits. It is also used in automotive electronics, appliances, telecommunications, and military applications. Because of its high efficiency performance, it is also suitable for use in other applications. The product is lightweight and small in size, making it easy to install in any application.

The ATS-06H-202-C2-R0 has a working principle where the heat from the component being cooled is released into the atmosphere through convection. The heat is transferred from the component to the base plate of the heat sink. Heat is then dissipated into the environment through the fins on the heat sink. The fan helps to evacuate more hot air from the system and increases the surface area of the heat sink, allowing it to dissipate more heat into the environment.

The ATS-06H-202-C2-R0 is designed for high-performance applications and provides an excellent thermal management solution. It is highly efficient, easy to install, and can handle a wide range of applications. In addition, it has a low cost and is offered in multiple sizes, making it a great choice for a wide variety of applications. As a result, the ATS-06H-202-C2-R0 makes for an ideal solution for any system requiring effective thermal management.

The specific data is subject to PDF, and the above content is for reference

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