ATS-06H-38-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-06H-38-C2-R0-ND

Manufacturer Part#:

ATS-06H-38-C2-R0

Price: $ 6.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X22.86MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06H-38-C2-R0 datasheetATS-06H-38-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.52888
30 +: $ 5.22186
50 +: $ 4.91463
100 +: $ 4.60744
250 +: $ 4.30028
500 +: $ 3.99312
1000 +: $ 3.91632
Stock 1000Can Ship Immediately
$ 6.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.42°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-06H-38-C2-R0 thermal-heat sink is a state-of-the-art product for cooling applications that features a black anodized aluminum frame, two-layer composite heat sink, and an efficient fin design to optimize heat dissipation. It is designed to fit into small, confined spaces with easy installation and maintenance.

Heat sinks’ main purpose is to draw heat away from their surroundings. In order to do that, the ATS-06H-38-C2-R0 utilizes thermal radiation, conductive and convective cooling techniques. Heat is first absorbed from the air and then released to a higher temperature zone. The heat absorbed from the air causes the object or component to cool down, which is the principle behind heat sink.

The ATS-06H-38-C2-R0 is particularly suited for cooling smaller electronic components as it does not require large amounts of space or material. Its compact design is able to handle high thermal loads, and its two-layer composite heat sink consists of a black anodized aluminum frame and a specially designed fin array. This design increases the surface area, allowing more air to make contact with the heat sink.

The fin array helps to efficiently transfer the heat to the surrounding air, while the black anodized aluminum surface ensures that the surface isn’t degraded by oxidation. Additionally, the frame structure effectively improves the structural strength and durability of the product. This makes the ATS-06H-38-C2-R0 an ideal choice for applications that require reliable and long-lasting performance.

Heat sinks are traditionally used in electronic components such as processors, memory chips, transistors, and LED lights. The ATS-06H-38-C2-R0 is able to effectively reduce the heat in these components as it has a high-performance design. This allows for efficient heat dissipation, even under continuous use, therefore preventing component damage.

In summary, the ATS-06H-38-C2-R0 thermal-heat sink is a great solution for cooling applications that require reliability and long-lasting performance. Its two-layer composite heat sink, black anodized aluminum frame, and especially designed fin array make it an efficient tool for dissipating heat, as it is able to effectively transfer heat away from its components. Additionally, its compact size allows for easy installation and maintenance, making it a great choice for a variety of electronic applications.

The specific data is subject to PDF, and the above content is for reference

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