| Allicdata Part #: | ATS-06H-54-C3-R0-ND |
| Manufacturer Part#: |
ATS-06H-54-C3-R0 |
| Price: | $ 4.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-06H-54-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.68991 |
| 30 +: | $ 3.48474 |
| 50 +: | $ 3.27978 |
| 100 +: | $ 3.07484 |
| 250 +: | $ 2.86985 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.61362 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are critical components in any electronic system. They remove any excess heat generated by the system’s components and regulate the system’s temperature. Without a properly functioning heat sink, the system can suffer from reduced performance or permanent damage. The ATS-06H-54-C3-R0 is an innovative heat sink designed to provide efficient heat dissipation while still meeting the requirements of high-performance systems.
The ATS-06H-54-C3-R0 utilizes an innovative design to optimize heat dissipation. It features a series of plate-like fins arranged in a spiral pattern. The spacing between the fins helps to create a strong air flow that is directed around the heat sink. This allows the air to effectively absorb the heat from the components. The fins are also designed in such a way that they provide superior heat dissipation in comparison to traditional designs.
The thermal performance of the ATS-06H-54-C3-R0 is enhanced by its extruded aluminum construction which is designed to dissipate heat quickly and evenly. The base of the heat sink is made from a high-grade copper material which helps to enhance thermal conductivity and efficiency. The contacting surfaces between the heat sink and the components are designed to be smooth and flat to ensure maximum heat transfer.
The ATS-06H-54-C3-R0 is optimized for use with a number of different processors and components. It can be used with CPUs, GPUs, and other high-performance components. The heat sink is designed for efficient operation with a variety of power supplies and thermal solutions. The heat sink also has an extended lifespan and is capable of withstanding temperatures of up to 85°C.
The ATS-06H-54-C3-R0 is an ideal thermal solution for a variety of applications. It provides superior heat dissipation capabilities and can be used with both low- and high-power components. The innovative design, efficient materials, and optimized performance make it an ideal choice for those looking for an effective heat dissipation solution.
The specific data is subject to PDF, and the above content is for reference
ATS-06H-54-C3-R0 Datasheet/PDF