| Allicdata Part #: | ATS-06H-58-C1-R0-ND |
| Manufacturer Part#: |
ATS-06H-58-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-58-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate air or liquid-cooled heat away from sensitive electronics or components. This is achieved by increasing surface area and/or propelling the flow of air or liquid so that heat can be more quickly dissipated away from the electronics or component. The ATS-06H-58-C1-R0 is a unique type of thermal heat sink that combines a robust base extrusion with a patented feature called High Striation Technology or HST™.The base extrusion is an extruded aluminum and or copper tube that is designed to transfer heat away from the component quickly. It is designed with a series of holes along the length of the tube that provide a path for heat to escape away from the product or device. These holes also allow for air and liquid to flow freely through the tube, transferring the heat away from the device quickly and efficiently.
The HST™ feature on the ATS-06H-58-C1-R0 is designed to improve heat transfer and efficiency. It is a patented design of asymmetric dimples and openings that are formed or carved into the extrusion. The dimples and openings disperse the air and liquid more evenly along the length of the tube, allowing for more efficient transfer of heat away from the device. This design also reduces the resistance to air and liquid flow and increases the cooling rate of the sink.
In addition to being extremely efficient, the ATS-06H-58-C1-R0 is also very durable and lightweight. The robust base extrusion is made from either aluminum or copper to ensure it can withstand the heat and vibrations associated with the operating environment. The HST™ feature further improves durability and reduces wear on the system by avoiding sharp edges or points that can backwind condensers or cause cavitations. The lightweight design also makes it easy to install and can be mounted in a variety of configurations.
The ATS-06H-58-C1-R0 thermal heat sink is an ideal solution for applications that require efficient and durable heat transfer. It is designed to dissipate both air and liquid cooled heat from sensitive electronics or components quickly and efficiently. The patented HST™ feature ensures maximum efficiency and the robust base extrusion allows for long-term durability. The lightweight design also makes it easy to install in a variety of configurations, making it a great choice for applications where efficient heat transfer is crucial.
The specific data is subject to PDF, and the above content is for reference