| Allicdata Part #: | ATS-06H-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-06H-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal devices used to dissipate heat from a component or system by transferring the heat generated by the component to a cooler medium, usually ambient air. The ATS-06H-76-C3-R0 is a type of heat sink designed to provide reliable cooling and maximum airflow to components with larger heatsinks. This heat sink utilizes a heat spreader that increases surface area, allowing more heat to be dissipated more quickly.
ATS-06H-76-C3-R0 Design
The ATS-06H-76-C3-R0 is designed to dissipate up to 8W of heat from components and systems with larger heat sinks. It features a flat black anodized aluminum construction with 76pcs cooling fins, as well as a copper heat spreader plate that increases system temperature for improved heat transfer. The ATS-06H-76-C3-R0 also features a black plastic fan cover for optimal noise reduction.
The thermal design of the ATS-06H-76-C3-R0 includes a unique fin design which reduces hotspots that are common in smaller heat sinks. This design ensures maximum cooling performance and reduces the risk of thermal runaway. The manufacturing process of the heatsink also includes a special grooved surface finish which ensures efficient heat dissipation, even when used with a high air flow system.
ATS-06H-76-C3-R0 Application Field and Working Principle
The ATS-06H-76-C3-R0 is a thermal management device that is ideal for applications where maximum cooling performance is required in a compact form factor. This type of heat sink is most commonly used in applications such as server and workstation CPUs, GPUs, high-end CPUs, and power amplifiers that require additional thermal management. The ATS-06H-76-C3-R0 is also ideal for applications where small, low-profile heat sinks are necessary, such as PCBs with tight space constraints.
The ATS-06H-76-C3-R0 works on the principle of thermal convection. Heat is generated within the component or system by utilizing electricity, and this heat is then transferred to the heatsink via a thermal paste or a metal plate that is designed to increase heat dissipation. The heat is then dissipated away from the component or system via the fin design of the heat sink. This fin design increases the surface area of the heat sink, which allows more air to flow past the fins and consequently increases the rate of heat dissipation.
Conclusion
The ATS-06H-76-C3-R0 is a reliable and efficient thermal management device that is ideal for applications where maximum cooling performance is required. With its effective heat dissipation capabilities, high air flow design, and low profile design, this type of heat sink is the perfect way to ensure optimal system temperatures and reduce the risk of overheating components.
The specific data is subject to PDF, and the above content is for reference