ATS-07A-06-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.15°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are important components in a variety of applications. ATS-07A-06-C1-R0 is a highly efficient thermal - heat sink that consists of a cylindrical aluminum fin and copper base, and it has excellent heat dissipation capability. It is the optimal choice for applications which need efficient cooling and heat dissipation.

Application Field

The ATS-07A-06-C1-R0 is designed to dissipate large amounts of heat generated by a variety of high-powered electronic components. It can be used in computers, servers and other electronic equipment where cooling and heat dissipation is of utmost importance. It is especially useful in applications such as integrated circuits, LED lighting, semiconductor devices, microprocessors, and other temperature sensitive electronics.In addition, this thermal - heat sink can also be used in industrial and automotive applications. It can be used to improve the cooling of car engines, reduce the temperature of motor bearings, and dissipate heat from transmissions. Furthermore, it is also suitable for large manufacturing machines, air conditioners, and other applications where efficient cooling is needed.

Working Principle

The main principle behind the ATS-07A-06-C1-R0 is the ability to transfer large amounts of heat from the component to the air or other medium. The extended aluminum fin provides a large surface area with excellent thermal conductivity, and the copper base spreads the heat evenly from the heat source. The heat is then dispersed to the surrounding air or other medium by natural or forced convection. Natural convection is driven by the hot air rising from the heat sink and dispersing the heat away from the component. Forced convection relies on a fan or other type of motive force to move the air or other medium past the heat sink, thus increasing the rate of heat transfer.The ATS-07A-06-C1-R0 also features a thermal grease that provides an extra barrier of protection against shock and vibration, which can potentially cause damage to the component.

Conclusion

The ATS-07A-06-C1-R0 thermal - heat sink is designed to efficiently and effectively transfer large amounts of heat away from high powered electronic components. It can be used in a variety of applications, from computers, servers and integrated circuits, to automotive components and industrial equipment. The extended aluminum fin and copper base provide excellent thermal conductivity and the thermal grease protects the components from shock and vibration. Therefore, the ATS-07A-06-C1-R0 is the ideal choice for applications where efficient and effective cooling and heat dissipation are necessary.

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