| Allicdata Part #: | ATS-07A-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-07A-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07 A-100-C3-R0 is a thermal-heat sink that is widely used across various industries. It works by transferring heat generated during operation away from sensitive components and out of the device. The ATS-07 A-100-C3-R0 is a highly effective heat-dissipation solution, proven through extensive research and development.
In general, the ATS-07 A-100-C3-R0 is designed to absorb heat generated from sensitive components during operation and transfer it to the surrounding air by dissipating it away from the device. This helps to maintain a cooler internal working environment and prevents components from overheating. Heat sinks are divided into two types, passive and active. A passive heat sink relies solely on the thermal properties of the material used, while an active heat sink uses air or liquid to transfer heat away from the device.
The design of the ATS-07 A-100-C3-R0 heat sink is designed to maximize the heat transfer rate and minimize thermal accumulation. It features a patented fin structure, which helps evenly dissipate heat away from the device. The fins are designed to capture air within constricted passages near the material surfaces, allowing it to cool down significantly faster than a traditional heat sink. Additionally, the fins help with even air distribution, providing maximum heat absorption.
The performance of the ATS-07 A-100-C3-R0 heat sink will depend on the application. For instance, in applications where the main heat source is located in close proximity to the device, the fins will become heated more quickly, resulting in faster heat dissipation. In larger applications, the airflow will be slower and the heat dissipation rate may be reduced. However, due to the unique design of the fins, the ATS-07 A-100-C3-R0 can provide efficient and effective cooling even in large applications.
Due to its effectiveness, high efficiency and reliability, the ATS-07 A-100-C3-R0 heat sink has become a preferred choice among many industries. It is typically used in computers, communications systems, medical equipment, and other electronic devices, where high-performance cooling is required. In addition, its durability ensures long-term performance and reliable operation in harsh environments. From medical facilities to military bases, the ATS-07 A-100-C3-R0 provides reliable cooling solutions for any application.
To summarize, the ATS-07 A-100-C3-R0 is a thermal-heat sink that works by transferring heat generated during operation away from sensitive components and out of the device. It features a patented fin structure, which helps evenly dissipate heat away from the device. Its performance will depend on the application, but it is an efficient, effective and reliable cooling solution for a wide variety of settings. The ATS-07 A-100-C3-R0 heat sink is an excellent choice for any application requiring high-performance cooling.
The specific data is subject to PDF, and the above content is for reference