| Allicdata Part #: | ATS12177-ND |
| Manufacturer Part#: |
ATS-07A-120-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-120-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to transfer and dissipate thermal energy away from a source. Heat sinks are used to cool electronic components in computers, consumer electronics, and power electronics applications. In these cases, heat dissipated by the heat sink protects the components from excessive temperatures, and allows the components to run more reliably.
The ATS-07A-120-C2-R0 is an advanced thermal heat sink designed for use in high-power applications. It is a pin-fin type heat sink, which offers optimized thermal performance due to its enhanced surface area. Its design also uses an aerodynamic design to achieve lower air drag, resulting in a quieter operation.
The ATS-07A-120-C2-R0 features a low-cost aluminum heat sink base that is ideal for large fin geometries. It also offers two heatsink mounting options: spring mounting or 0.5" aluminum rivets for easy installation. Additionally, it is compatible with all standard airflows from 50-2000 CFM, making it easy to install in any application.
The ATS-07A-120-C2-R0 works by transferring heat from the processor or component to the heat sink. This is done by using thermal conduction. Thermal conduction is the transfer of heat through direct physical contact. The heat is then dissipated into the air or other surfaces by means of convection. Convection is the process of transferring heat through circulation, such as the flow of air around the heat sink. As the air circulates, it carries the heat away from the source and helps to reduce the temperature of the processor or component.
The ATS-07A-120-C2-R0 is designed to provide optimal heat dissipation performance. It is constructed from anodized aluminum, which makes it light and corrosion resistant. The fin array allows for increased thermal transfer, while its airflow design ensures that heat is dissipated quickly and efficiently. Its design also ensures a quiet and low-noise operation, making it an ideal choice for high-power applications that require optimal cooling performance.
Overall, the ATS-07A-120-C2-R0 is an advanced thermal heat sink designed for use in high-power applications. It is constructed from anodized aluminum and features an optimized fin array for enhanced thermal performance. Its design also uses an aerodynamic design for reduced air drag, resulting in a quiet operation. Additionally, it is compatible with all standard airflows from 50-2000 CFM, making it an ideal choice for high-power applications that require optimal cooling performance.
The specific data is subject to PDF, and the above content is for reference