ATS-07A-128-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal-heat sinks are essential components used in a variety of electronic devices in order to dissipate heat generated by the components during operation or to remove excess heat from the surrounding environment. The ATS-07A-128-C3-R0 is a high-efficiency thermal-heat sink designed for applications with tight thermal envelopes.The ATS-07A-128-C3-R0 is composed of a metal bottom plate that serves as a thermal connection point, and a graphite filled top plate that acts as a heat spreader. The metal bottom plate is typically made of copper, while the top plate is made of silicon, and both plates are surrounded by a layer of non-conductive air. The bottom plate is designed to be in direct contact with the heat source, such as an integrated circuit or a processor, while the top plate is designed to disperse the heat evenly across the metal bottom plate.The ATS-07A-128-C3-R0 offers several advantages over other types of heat sinks. First, the graphite filled top plate further aids in the thermal dispersion of the heat generated by the components during operation, providing a more effective heat sink than metal plates alone. Second, the metal bottom plate provides a better thermal connection to the heat source, ensuring that the heat is efficiently dissipated. Finally, the non-conductive air layer helps to reduce the amount of heat lost to the surrounding environment.The ATS-07A-128-C3-R0 is ideal for applications that require a high-efficiency thermal-heat sink, as it can effectively dissipate heat from the heat source without compromising on size, weight, or efficiency. It has a wide range of applications, from computer systems, servers, telecommunications devices, consumer electronics, and medical equipment, to automotive and aerospace products.The ATS-07A-128-C3-R0 works on the principle of thermal convection. The metal bottom plate serves as a thermal connection point, allowing it to efficiently transfer heat from the heat source to the heat sink. Then, the graphite filled top plate serves as a heat spreader, helping to further dissipate the heat across the thermal-heat sink. Finally, the non-conductive air surrounding the metal bottom plate and top plate helps to further reduce the amount of heat lost to the surrounding environment.Overall, the ATS-07A-128-C3-R0 offers an efficient and cost-effective solution for applications that require a high-efficiency thermal-heat sink. It is ideal for applications with tight thermal envelopes, as it can effectively dissipate heat from the heat source without compromising on size, weight, or efficiency. Furthermore, the graphite filled top plate and non-conductive air layer make the ATS-07A-128-C3-R0 an excellent choice for applications that require a high level of heat dissipation.

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