| Allicdata Part #: | ATS12188-ND |
| Manufacturer Part#: |
ATS-07A-130-C2-R0 |
| Price: | $ 5.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-130-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.83840 |
| 10 +: | $ 4.70799 |
| 25 +: | $ 4.44604 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to ensure the smooth running of a device and enhance its performance. Heat sinks are a critical component necessary for optimal thermal management. ATS-07A-130-C2-R0 is a type of heat sink that is used in a variety of applications and provides efficient thermal management.
Advanced Thermal Solutions (ATS) is a leading manufacturer of advanced thermal solutions, providing advanced heat sinks for various electronics applications. The ATS-07A-130-C2-R0 is a heat sink designed for use in electronics applications that require efficient cooling. The ATS-07A-130-C2-R0 provides superior thermal performance as well as low air circulation resistance, making it an ideal choice for applications such as CPUs and GPUs, high-frequency boards and active components.
One of the main advantages of the ATS-07A-130-C2-R0 is its ability to deliver efficient thermal management. The heat sink is constructed of aluminum alloy, which has a high thermal conductivity. The heat sink is then designed to maximize heat dissipation by providing a large surface area, with an array of finned channels to allow for optimal airflow. The finned channels are designed to facilitate increased air convection, to further enhance heat dissipation. The ATS-07A-130-C2-R0 also incorporates an internal heat pipe to provide additional cooling. The design of the heat pipe allows heat to quickly and evenly disperse throughout the heat sink, resulting in an even temperature distribution.
In addition to superior thermal performance, the ATS-07A-130-C2-R0 is also designed to facilitate easy installation. The heat sink features a standard assembly with no additional mounting hardware required. The unit’s modular design allows for easy maintenance and replacement, while its slim profile allows for installation into even the smallest of applications. Additionally, the heat sink features a built-in fan to provide additional cooling, as well as additional cooling options such as liquid cooling and heat spreaders.
The ATS-07A-130-C2-R0 is an advanced heat sink that provides superior thermal performance and easy installation. The unit features a large surface area, with finned channels to facilitate superior heat dissipation. Additionally, the unit is designed to facilitate easy maintenance and replacement, and also features a built-in fan to provide additional cooling options. The ATS-07A-130-C2-R0 is an ideal choice for applications such as CPUs and GPUs, high-frequency boards and active components, and is a great choice for any electronic device requiring efficient cooling.
The specific data is subject to PDF, and the above content is for reference