ATS-07A-131-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Thermal heat sinks are an essential part of any system in which heat dissipation needs to be efficiently managed to avoid system failure. ATS-07A-131-C1-R0 is one of the models of thermal heat sink that is widely used for the purpose of cooling in electronic systems. This article presents an overview of the application field and working principle of ATS-07A-131-C1-R0. Application Field
The ATS-07A-131-C1-R0 heat sink is suitable for a wide range of applications such as electrical and thermal control, LED lighting, telecommunications, automotive, consumer electronic, industrial, computing, and other heat dissipation applications. It is highly suitable for heavy-duty applications due to its ability to dissipate heat quickly and efficiently.The ATS-07A-131-C1-R0 heat sink provides higher thermal efficiency than other similar products. It has a good thermal conductivity rating that is up to four times more effective than other thermal heat sinks, making it the ideal choice for cooling systems that require high levels of performance.The ATS-07A-131-C1-R0 heat sink is also suitable for use in environments with high temperatures. It has a special coating that has been designed to increase its heat dissipation capabilities, making it suitable for use in environments where temperatures reach up to 180 degrees Celsius.Working Principle
The ATS-07A-131-C1-R0 thermal heat sink works by dissipating heat away from the mechanisms within the system. It is designed to efficiently dissipate heat by utilizing a combination of convection, conduction, and radiation.The convection is generated by air passing over the heat sink fins. The fins work to create more surface area, allowing more air to flow over the device, thus increasing the rate of the heat dissipation. The fins also help to create turbulence, which further enhances heat dissipation.The conduction process works via a combination of solid metal components and thermal grease. The solid metal components serve as a thermal bridge allowing heat to move from the device to the heat sink. The thermal grease is applied between the device and heat sink to increase thermal bond and ensure better heat transfer.The radiation process works by radiating some of the heat away from the area where the heat sink is located. This helps create a more even spread of heat over a larger area which further aids in cooling the device.Conclusion
The ATS-07A-131-C1-R0 thermal heat sink is an ideal choice for applications requiring efficient heat dissipation. The device’s combination of convection, conduction, and radiation processes make it a highly reliable thermal solution for applications in which temperatures reach up to 180 degrees Celsius. Its unique coating increases its already high thermal efficiency, making it an ideal choice for cooling systems.

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