| Allicdata Part #: | ATS12193-ND |
| Manufacturer Part#: |
ATS-07A-135-C2-R0 |
| Price: | $ 7.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-135-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.81030 |
| 10 +: | $ 6.43419 |
| 25 +: | $ 6.05581 |
| 50 +: | $ 5.67743 |
| 100 +: | $ 5.29887 |
| 250 +: | $ 4.92040 |
| 500 +: | $ 4.82577 |
| 1000 +: | $ 4.73114 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical aspect of electronics. Heat generation creates the potential for device failure and, more importantly, degraded performance over time. Particularly in high-performance electronics, it is critical that heat is dissipated quickly and evenly. Heat sinks are a vital part of any thermal management system, transferring heat away from electronic components by convection. The ATS-07A-135-C2-R0 heat sink is a popular choice for high-performance electronic systems.
The ATS-07A-135-C2-R0 heat sink is a rectangular aluminum plate with anodized black finish. It measures 135mm x 135mm and is oriented vertically, with a height of 75mm. Integrated onto the plate are three extruded fins, measuring 25mm long and 15mm wide. The fin spacing is 8mm apart. Additionally, two large holes are provided for mounting with 4-40 screws. The heat sink has a total weight of 180 grams.
The ATS-07A-135-C2-R0 has a very efficient profile for convective heat transfer. Its base is composed of highly conductive aluminum, allowing for rapid heat transfers from semiconductor materials. The extruded fins allow for further thermal transfer, providing a larger surface area for the same plate size, maximizing thermal performance. The design maximizes surface area exposure to the airflow of a fan, while minimizing noise. The anodized black finish on the baseplate also helps to eliminate noise due to vibrations.
The ATS-07A-135-C2-R0 is capable of dissipating up to 70 Watts of heat. This makes it suitable for use in high-performance electronic devices, such as gaming consoles, digital audio equipment, and medical imaging systems. It is also a great choice for prototyping, as it is easy to integrate into circuit boards with 4-40 screws. Additionally, its reliable thermal performance makes it suitable for use in many industrial applications.
Conclusion
The ATS-07A-135-C2-R0 heat sink is an efficient and reliable thermal solution for high-performance electronics applications. Its aluminum baseplate and three extruded fins maximize surface area exposure to airflow and promote effective convection-based heat transfer. Its robust design is capable of dissipating up to 70 Watts of heat, making it suitable for use in a variety of industries.
The specific data is subject to PDF, and the above content is for reference